Predicted protein targets (top 1)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | LCK | P06239 | 1/20 | 0.32 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL962161 | 0.93 | LCK (0.36) | LCK | |
| SCHEMBL394601 | 0.93 | LCK (0.36) | LCK | |
| SCHEMBL31714587 | 0.91 | LMNA (0.33) | — | |
| SCHEMBL291935 | 0.91 | LCK (0.38) | LCK | |
| SCHEMBL337730 | 0.91 | LCK (0.38) | LCK | |
| SCHEMBL12190565 | 0.87 | LCK (0.35) | LCK | |
| SCHEMBL12190478 | 0.84 | LCK (0.37) | LCK | |
| SCHEMBL28958346 | 0.83 | LCK (0.35) | LCK | |
| SCHEMBL9776544 | 0.83 | LMNA (0.33) | — | |
| SCHEMBL2244060 | 0.82 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 9 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20230159709-A1 | Amine Functionalized Siloxane Resin Particles | AGFA NV (BE) | 2023-05-25 | — | — | US | disclosed |
| CN-110914756-B | Photosensitive resin composition, resin film, and electronic device | 住友电木株式会社 | 2021-05-04 | — | — | CN | disclosed |
| CN-112689800-A | Photosensitive resin composition for forming permanent film, cured film, electronic device, method for producing cured film, and method for producing electronic device | 住友电木株式会社 | 2021-04-20 | — | — | CN | disclosed |
| CN-110809737-B | Photosensitive resin composition, resin film, and electronic device | 住友电木株式会社 | 2020-11-17 | — | — | CN | disclosed |
| CN-110914756-A | Photosensitive resin composition, resin film, and electronic device | 住友电木株式会社 | 2020-03-24 | — | — | CN | disclosed |
| CN-110809737-A | Photosensitive resin composition, resin film, and electronic device | 住友电木株式会社 | 2020-02-18 | — | — | CN | disclosed |
| US-5149839-A | Improved impregnation, solvent resistance, heat resistance and low water absoprtion properties | NITTO BOSEKI CO., LTD. (JP) | 1992-09-22 | — | — | US | disclosed |
| US-5069971-A | With epoxy resins, printed circuits, diaminoalklyalkoxysilane | NITTO BOSEKI CO., LTD. (JP) | 1991-12-03 | — | — | US | disclosed |
| EP-0368279-A1 | Silane coupling agent and glass fiber product for laminates | NITTO BOSEKI CO., LTD. (JP) | 1990-05-16 | — | — | EP | disclosed |