SCHEMBL9702229

SCHEMBL9702229

CO[Si](C)(C)CCCN(CCN)CCC[Si](C)(C)OC

nearest known ligand 0.36

Predicted protein targets (top 1)

geneUniProtsupporting neighboursconfidence
LCK P06239 1/20 0.36

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL15265495 0.89
SCHEMBL962161 0.83 LCK (0.36) LCK
SCHEMBL394601 0.83 LCK (0.36) LCK
SCHEMBL5701265 0.81 CA12 (0.30)
SCHEMBL291935 0.81 LCK (0.38) LCK
SCHEMBL16714861 0.81
SCHEMBL337730 0.81 LCK (0.38) LCK
SCHEMBL612821 0.79
SCHEMBL16813125 0.79 ALDH1A1 (0.35)
SCHEMBL16813615 0.79

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2020054644-A1 PERMANENT FILM-FORMING PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, ELECTRONIC DEVICE, CURED FILM PRODUCTION METHOD, AND ELECTRONIC DEVICE MANUFACTURING METHOD 住友ベークライト株式会社 2020-03-19 WO disclosed
US-5149839-A Improved impregnation, solvent resistance, heat resistance and low water absoprtion properties NITTO BOSEKI CO., LTD. (JP) 1992-09-22 US disclosed
US-5069971-A With epoxy resins, printed circuits, diaminoalklyalkoxysilane NITTO BOSEKI CO., LTD. (JP) 1991-12-03 US disclosed
EP-0368279-A1 Silane coupling agent and glass fiber product for laminates NITTO BOSEKI CO., LTD. (JP) 1990-05-16 EP disclosed