SCHEMBL970938

SCHEMBL970938

Cc1ccc(N(c2ccc(C)cc2)S(=O)(=O)N(c2ccc(C)cc2)c2ccc(C)cc2)cc1

nearest known ligand 0.52

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
MAPT P10636 2/20 0.52
MCOLN3 Q8TDD5 1/20 0.52
ALDH1A1 P00352 6/20 0.50
TSHR P16473 1/20 0.50
GAA P10253 2/20 0.48
TDP1 Q9NUW8 2/20 0.44
ACHE P22303 1/20 0.44
CA1 P00915 4/20 0.44
CA2 P00918 4/20 0.44
CA9 Q16790 3/20 0.44
CA12 O43570 2/20 0.44
CA3 P07451 1/20 0.44
CA6 P23280 1/20 0.44
CA5A P35218 1/20 0.44
CA7 P43166 1/20 0.44
CA5B Q9Y2D0 1/20 0.44
LMNA P02545 1/20 0.42
MAPK1 P28482 1/20 0.42
GFER P55789 1/20 0.42
MCL1 Q07820 1/20 0.42

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL10632564 0.82 MAPT (0.47) MAPTMCOLN3ALDH1A1TSHRGAA
SCHEMBL10632573 0.82 CA1 (0.50) MAPTMCOLN3ALDH1A1TSHRGAA
SCHEMBL3701001 0.80 MAPT (0.67) MAPTMCOLN3ALDH1A1GAACA9
SCHEMBL7074889 0.75 ALDH1A1 (0.51) MAPTMCOLN3ALDH1A1GAACA9
SCHEMBL3702995 0.75 ALDH1A1 (0.63) MAPTMCOLN3ALDH1A1CA9CA12
SCHEMBL10285578 0.75 MAPT (0.61) MAPTMCOLN3ALDH1A1TSHRGAA
SCHEMBL12994623 0.74 MAPT (0.48) MAPTMCOLN3ALDH1A1TSHRGAA
SCHEMBL26310493 0.72 MAPT (0.47) MAPTMCOLN3ALDH1A1TSHRGAA
SCHEMBL11598690 0.72 MAPT (0.47) MAPTMCOLN3ALDH1A1TSHRGAA
SCHEMBL3467608 0.72 MAPT (0.63) MAPTMCOLN3ALDH1A1TSHRGAA

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 132 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20240071781-A1 METHOD FOR SEALING ELECTRONIC COMPONENT MOUNTING SUBSTRATE, AND HEAT-CURABLE SHEET NAGASE CHEMTEX CORPORATION (JP) 2024-02-29 US disclosed
EP-4287250-A1 METHOD FOR SEALING ELECTRONIC COMPONENT MOUNTING SUBSTRATE, AND HEAT-CURABLE SHEET NAGASE CHEMTEX CORPORATION (JP) 2023-12-06 EP disclosed
EP-4224243-A1 SPECTACLE LENS Hoya Lens Thailand Ltd. (TH) 2023-08-09 EP disclosed
US-11718770-B2 Curable resin composition and curable sheet NAGASE CHEMTEX CORPORATION (JP) 2023-08-08 US disclosed
US-20230116314-A1 SPECTACLE LENS HOYA LENS THAILAND LTD. (TH) 2023-04-13 US disclosed
US-11608435-B2 Epoxy resin composition, electronic component mounting structure, and method for producing the same NAGASE CHEMTEX CORPORATION (JP) 2023-03-21 US disclosed
EP-3623870-B1 IMAGE FORMING APPARATUS AND TONER SET RICOH CO LTD (JP) 2022-05-04 EP disclosed
US-20210403765-A1 CURABLE RESIN COMPOSITION AND CURABLE SHEET NAGASE CHEMTEX CORPORATION (JP) 2021-12-30 US disclosed
EP-3418811-B1 TONER, DEVELOPER, PROCESS CARTRIDGE, IMAGE FORMING APPARATUS, IMAGE FORMING METHOD, AND METHOD FOR MANUFACTURING TONER RICOH CO LTD (JP) 2021-07-28 EP disclosed
US-10895816-B2 Image forming apparatus and toner set RICOH COMPANY, LTD. (JP) 2021-01-19 US disclosed
US-5098953-A Melt kneading a polybutylene terephthalate and a glycidyl ester of acrylate or methacrylate and ethylene copolymer SUMITOMO CHEMICAL CO. LTD. (JP) 1992-03-24 US disclosed
US-5086117-A Melt-kneading polyester with ethylene copolymer consisting of unsaturated carboxylic acid glycidyl ester and alkyl ester units SUMITOMO CHEMICAL CO., LTD. (JP) 1992-02-04 US disclosed
US-5086116-A Melt kneading polybutylene terephthalate with epoxy group containing ethylene copolymer and crosslinking SUMITOMO CHEMICAL CO., LTD. (JP) 1992-02-04 US disclosed
US-5086119-A METHOD FOR PRODUCING THERMOPLASTIC RESIN COMPOSITION SUMITOMO CHEMICAL CO., LTD. (JP) 1992-02-04 US disclosed
US-5068283-A Melt kneading polyester with epoxy group containing ethylene copolymer; crosslinking SUMITOMO CHEMICAL CO., LTD. (JP) 1991-11-26 US disclosed
US-5047478-A Crosslinked Polyamide, Ethylene Copolymer Blend For Molded Articles SUMITOMO CHEMICAL CO., LTD. (JP) 1991-09-10 US disclosed
EP-0400890-A2 Method for producing thermoplastic elastomer composition SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 1990-12-05 EP disclosed
EP-0382539-A1 Moldable polyamide resin composition and production thereof SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 1990-08-16 EP disclosed
EP-0285256-A2 Method for producing a thermoplastic resin composition SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 1988-10-05 EP disclosed
EP-0258040-A1 Thermoplastic resin composition comprising a polyamide SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 1988-03-02 EP disclosed