Formaldehyde

Formaldehyde

SCHEMBL9717809

C=O.Cc1c(O)ccc2c1O2

nearest known ligand 0.39

Full drug profile on Sugi Atlas →

Predicted protein targets (top 12)

geneUniProtsupporting neighboursconfidence
ESR2 Q92731 14/20 0.39
ESR1 P03372 12/20 0.39
KDM4E B2RXH2 2/20 0.38
MAPK1 P28482 1/20 0.38
TYR P14679 1/20 0.36
CNR2 P34972 1/20 0.35
MAOB P27338 1/20 0.34
ALDH1A1 P00352 1/20 0.33
GAA P10253 1/20 0.33
SMN1; SMN2 Q16637 1/20 0.33
TRPA1 O75762 1/20 0.33
ATM Q13315 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL33480 0.93
Urea SCHEMBL27402617 0.92 ESR2 (0.35) ESR2ESR1KDM4EMAPK1TYR
SCHEMBL30301367 0.91 ESR2 (0.41) ESR2ESR1KDM4EMAPK1TYR
Urea SCHEMBL27878783 0.88 ESR2 (0.37) ESR2ESR1KDM4EMAPK1TYR
Phenol SCHEMBL5049852 0.82 CA12 (0.42) ESR2ESR1TYRCNR2ALDH1A1
Phenol SCHEMBL28146909 0.82 CA12 (0.42) ESR2ESR1TYRCNR2ALDH1A1
SCHEMBL17961669 0.80 ESR1 (0.39) ESR2ESR1TYRCNR2
Paraben SCHEMBL4654906 0.79 CA2 (0.52) ESR2ESR1KDM4ETYRALDH1A1
Formaldehyde SCHEMBL28064264 0.77 KDM4E (0.43) KDM4EALDH1A1
SCHEMBL1856942 0.75

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 11 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-112368328-A R-based rubber composition 米其林集团总公司 2021-02-12 CN claimed
CN-103797083-B The BMI of softness, benzimidazole dihydrochloride, epoxy anhydride adduct mixed adhesive 宝特威韩国株式会社 2016-07-27 CN claimed
CN-103797083-A Flexible bismaleimide, benzoxazine, epoxy-anhydride adduct hybrid adhesive PROTAVIC KOREA CO LTD 2014-05-14 CN claimed
CN-112912257-B Rubber composition based on epoxy resin, amine hardener and imidazole 米其林集团总公司 2023-02-17 CN disclosed
CN-112912257-A Rubber composition based on epoxy resin, amine hardener and imidazole 米其林集团总公司 2021-06-04 CN disclosed
CN-112368328-A R-based rubber composition 米其林集团总公司 2021-02-12 CN disclosed
CN-106653734-B Semiconductor device with electromagnetic interference shielding and method of manufacturing the same 晟碟半导体(上海)有限公司 2020-04-21 CN disclosed
CN-108137838-A Prepreg and composite production using prepreg 吉瑞特(英国)有限公司 2018-06-08 CN disclosed
CN-1304505-C Powder coating compositions GEN ELECTRIC (US) 2007-03-14 CN disclosed
CN-1402767-A Powder coating compositions GEN ELECTRIC (US) 2003-03-12 CN disclosed
US-5108824-A Electrical component encapsulants with improved thermal shock resistance THE DOW CHEMICAL COMPANY (US) 1992-04-28 US disclosed