SCHEMBL9717977

SCHEMBL9717977

C=C(/C=C/CCC)CCC

nearest known ligand 0.35

Predicted protein targets (top 5)

geneUniProtsupporting neighboursconfidence
TAS1R3 Q7RTX0 1/20 0.35
TAS1R1 Q7RTX1 1/20 0.35
TSHR P16473 2/20 0.33
ALDH1A1 P00352 2/20 0.33
PPARG P37231 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL4858691 1.00 TAS1R3 (0.35) TAS1R3TAS1R1TSHRALDH1A1PPARG
SCHEMBL2273591 0.86 TSHR (0.44) TSHRALDH1A1PPARG
SCHEMBL10565473 0.86 TSHR (0.39) TAS1R3TAS1R1TSHRALDH1A1PPARG
SCHEMBL18433538 0.84 PPARA (0.36)
SCHEMBL2135515 0.82 PPARG (0.44) PPARG
SCHEMBL2135527 0.82 PPARG (0.44) PPARG
SCHEMBL2058632 0.82
SCHEMBL3642395 0.82
SCHEMBL2058634 0.82
SCHEMBL3642394 0.82

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 3 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-0348906-B1 HEAT-RESISTANT RESIN COMPOSITION SHOWA DENKO KABUSHIKI KAISHA (JP) 1992-10-07 EP disclosed
US-4994515-A Resin of styrene and unsaturated imide, high impact thermoplastic, bromine-containing reaction product, silicon resin or compound SHOWA DENKO KABUSHIKI KAISHA (JP) 1991-02-19 US disclosed
EP-0348906-A1 Heat-resistant resin composition SHOWA DENKO KABUSHIKI KAISHA (JP) 1990-01-03 EP disclosed