Predicted protein targets (top 5)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | ALDH1A1 | P00352 | 2/20 | 0.39 |
| ▸ | KDM1A | O60341 | 2/20 | 0.35 |
| ▸ | KDM1B | Q8NB78 | 1/20 | 0.35 |
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.34 |
| ▸ | MAPT | P10636 | 1/20 | 0.31 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL9718176 | 0.93 | ALDH1A1 (0.41) | ALDH1A1KDM1AKDM1BTDP1MAPT | |
| SCHEMBL29239899 | 0.90 | ALDH1A1 (0.42) | ALDH1A1TDP1 | |
| SCHEMBL9718098 | 0.88 | ALDH1A1 (0.41) | ALDH1A1KDM1AKDM1BTDP1MAPT | |
| SCHEMBL9838335 | 0.84 | ALDH1A1 (0.50) | ALDH1A1TDP1 | |
| SCHEMBL7079021 | 0.79 | ALDH1A1 (0.46) | ALDH1A1TDP1 | |
| SCHEMBL15008091 | 0.77 | ALDH1A1 (0.33) | ALDH1A1TDP1 | |
| SCHEMBL6187165 | 0.76 | TDP1 (0.46) | ALDH1A1KDM1AKDM1BTDP1MAPT | |
| SCHEMBL23351729 | 0.76 | KDM1A (0.48) | ALDH1A1KDM1AKDM1BTDP1MAPT | |
| SCHEMBL30718083 | 0.76 | KHK (0.40) | ALDH1A1 | |
| SCHEMBL28417064 | 0.73 | ALDH1A1 (0.50) | ALDH1A1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 3 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-0348906-B1 | HEAT-RESISTANT RESIN COMPOSITION | SHOWA DENKO KABUSHIKI KAISHA (JP) | 1992-10-07 | — | — | EP | disclosed |
| US-4994515-A | Resin of styrene and unsaturated imide, high impact thermoplastic, bromine-containing reaction product, silicon resin or compound | SHOWA DENKO KABUSHIKI KAISHA (JP) | 1991-02-19 | — | — | US | disclosed |
| EP-0348906-A1 | Heat-resistant resin composition | SHOWA DENKO KABUSHIKI KAISHA (JP) | 1990-01-03 | — | — | EP | disclosed |