Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | TDP1 | Q9NUW8 | 3/20 | 0.41 |
| ▸ | L3MBTL1 | Q9Y468 | 5/20 | 0.40 |
| ▸ | NPC1 | O15118 | 1/20 | 0.40 |
| ▸ | HTR2A | P28223 | 4/20 | 0.39 |
| ▸ | SLC6A4 | P31645 | 4/20 | 0.39 |
| ▸ | SMN1; SMN2 | Q16637 | 2/20 | 0.38 |
| ▸ | HAO1 | Q9UJM8 | 1/20 | 0.38 |
| ▸ | KMT2A | Q03164 | 2/20 | 0.37 |
| ▸ | LMNA | P02545 | 1/20 | 0.37 |
| ▸ | GFER | P55789 | 1/20 | 0.37 |
| ▸ | MAPT | P10636 | 2/20 | 0.37 |
| ▸ | HTT | P42858 | 1/20 | 0.36 |
| ▸ | MEN1 | O00255 | 1/20 | 0.36 |
| ▸ | HPGD | P15428 | 1/20 | 0.36 |
| ▸ | KCNH2 | Q12809 | 3/20 | 0.36 |
| ▸ | ALDH1A1 | P00352 | 2/20 | 0.36 |
| ▸ | DRD2 | P14416 | 1/20 | 0.35 |
| ▸ | DRD4 | P21917 | 1/20 | 0.35 |
| ▸ | DRD3 | P35462 | 1/20 | 0.35 |
| ▸ | ESR1 | P03372 | 1/20 | 0.35 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL29489131 | 1.00 | TDP1 (0.41) | TDP1L3MBTL1NPC1HTR2ASLC6A4 | |
| SCHEMBL798981 | 0.83 | AR (0.39) | TDP1HTR2ASLC6A4ALDH1A1 | |
| SCHEMBL11338994 | 0.83 | AR (0.34) | HTR2ASLC6A4MAPTKCNH2 | |
| SCHEMBL20432862 | 0.81 | TSHR (0.43) | L3MBTL1ALDH1A1POLB | |
| SCHEMBL25680960 | 0.81 | AR (0.44) | ALDH1A1 | |
| SCHEMBL24203435 | 0.81 | ALDH1A1 (0.45) | TDP1NPC1SMN1; SMN2KMT2AMAPT | |
| SCHEMBL16939068 | 0.81 | HTR2A (0.42) | TDP1L3MBTL1NPC1HTR2ASLC6A4 | |
| SCHEMBL16939067 | 0.81 | MCL1 (0.46) | TDP1NPC1HTR2ASLC6A4SMN1; SMN2 | |
| SCHEMBL13728524 | 0.81 | MAPT (0.35) | NPC1SMN1; SMN2HAO1KMT2ALMNA | |
| SCHEMBL25991389 | 0.81 | CYP1A2 (0.36) | L3MBTL1SMN1; SMN2HPGDALDH1A1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 58 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-5091476-A | Fireproofing | THE DOW CHEMICAL COMPANY (US) | 1992-02-25 | — | — | US | claimed |
| EP-0378103-A2 | Cyanate ester resin blends with brominated styrene containingpolymers | THE DOW CHEMICAL COMPANY (US) | 1990-07-18 | — | — | EP | claimed |
| CN-118251445-A | Cyclic organosiloxane containing imide bond and polymerizable unsaturated bond and curable resin composition containing the same | 信越化学工业株式会社 | 2024-06-25 | — | — | CN | disclosed |
| CN-118043384-A | Prepreg, laminate and printed circuit board | 三菱瓦斯化学株式会社 | 2024-05-14 | — | — | CN | disclosed |
| CN-112236464-B | Resin composition, prepreg, metal foil-clad laminate, resin sheet, and printed wiring board | 三菱瓦斯化学株式会社 | 2024-02-23 | — | — | CN | disclosed |
| CN-117529509-A | Resin composition, resin sheet, multilayer printed wiring board, and semiconductor device | 三菱瓦斯化学株式会社 | 2024-02-06 | — | — | CN | disclosed |
| CN-117500850-A | Resin composition, resin sheet, multilayer printed wiring board, and semiconductor device | 三菱瓦斯化学株式会社 | 2024-02-02 | — | — | CN | disclosed |
| CN-117500851-A | Resin composition, resin sheet, multilayer printed wiring board, and semiconductor device | 三菱瓦斯化学株式会社 | 2024-02-02 | — | — | CN | disclosed |
| CN-117355545-A | Resin composition, resin sheet, multilayer printed wiring board, and semiconductor device | 三菱瓦斯化学株式会社 | 2024-01-05 | — | — | CN | disclosed |
| CN-117222682-A | Cured resin composition and cured product thereof | 日本化药株式会社 | 2023-12-12 | — | — | CN | disclosed |
| CN-116940617-A | Resin composition, resin sheet, multilayer printed wiring board, and semiconductor device | 日本化药株式会社 | 2023-10-24 | — | — | CN | disclosed |
| CN-107001767-B | Resin combination, prepreg, clad with metal foil plywood, resin compounded piece and printed circuit board | 三菱瓦斯化学株式会社 | 2018-11-02 | — | — | CN | disclosed |
| CN-107001767-A | Resin combination, prepreg, clad with metal foil plywood, resin compounded piece and printed circuit board (PCB) | 三菱瓦斯化学株式会社 | 2017-08-01 | — | — | CN | disclosed |
| CN-104755422-B | Method for producing cyanogen halide, cyanate ester compound and method for producing same, and resin composition | 三菱瓦斯化学株式会社 | 2016-11-09 | — | — | CN | disclosed |
| CN-105960427-A | Resin composition for printed wiring board, prepreg, metal foil-clad laminate, resin composite sheet, and printed wiring board | 三菱瓦斯化学株式会社 | 2016-09-21 | — | — | CN | disclosed |
| CN-105705578-A | Resin composition, prepreg, laminated sheet, and metal-foil-clad laminated board | 三菱瓦斯化学株式会社 | 2016-06-22 | — | — | CN | disclosed |
| CN-105683154-A | Cyanate ester compound, curable resin composition containing the same, and cured product thereof | 三菱瓦斯化学株式会社 | 2016-06-15 | — | — | CN | disclosed |
| CN-105308084-A | Cyanate ester compound, curable resin composition containing said compound, and cured product of said composition | MITSUBISHI GAS CHEMICAL CO | 2016-02-03 | — | — | CN | disclosed |
| CN-105308118-A | Resin composition, prepreg, resin sheet, and metal foil-clad laminate | MITSUBISHI GAS CHEMICAL CO | 2016-02-03 | — | — | CN | disclosed |
| CN-104755422-A | Method for producing cyanogen halide, cyanate ester compound and method for producing same, and resin composition | MITSUBISHI GAS CHEMICAL CO | 2015-07-01 | — | — | CN | disclosed |