SCHEMBL9720919

SCHEMBL9720919

CCCCCCCCCc1nc2cc(C)c(C)cc2[nH]1

nearest known ligand 1.00 ✓ in ChEMBL — recovers established targets

Predicted protein targets (top 13)

geneUniProtsupporting neighboursconfidence
KMT2A Q03164 3/20 0.58
MAPT P10636 3/20 0.58
MEN1 O00255 2/20 0.58
TDP1 Q9NUW8 2/20 0.58
PSMD14 O00487 1/20 0.58
MMP2 P08253 1/20 0.58
ATM Q13315 1/20 0.58
PKM P14618 2/20 0.50
PDE10A Q9Y233 1/20 0.50
KDM4E B2RXH2 1/20 0.50
L3MBTL1 Q9Y468 1/20 0.50
GPR84 Q9NQS5 5/20 0.48
FABP6 P51161 1/20 0.46

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL9721048 1.00 KMT2A (0.58) KMT2AMAPTMEN1TDP1PSMD14
SCHEMBL19025143 1.00 KMT2A (0.58) KMT2AMAPTMEN1TDP1PSMD14
SCHEMBL29749431 0.98 KMT2A (0.60) KMT2AMAPTMEN1TDP1PSMD14
SCHEMBL9123593 0.93 KMT2A (0.62) KMT2AMAPTMEN1TDP1PSMD14
SCHEMBL12837407 0.86 KMT2A (0.66) KMT2AMAPTMEN1TDP1PSMD14
SCHEMBL1888288 0.84 KMT2A (0.58) KMT2AMAPTMEN1TDP1PSMD14
SCHEMBL7265894 0.83 KMT2A (0.54) KMT2AMAPTMEN1TDP1PSMD14
SCHEMBL9720968 0.83 GAA (0.66) KMT2AMAPTMEN1TDP1PKM
SCHEMBL6757262 0.83 GAA (0.66) KMT2AMAPTMEN1TDP1PKM
SCHEMBL9721038 0.81 KMT2A (0.60) KMT2AMAPTMEN1TDP1PKM

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-5173130-A Immersing copper or alloy to be soldered in an aqueous solution containing a 2-alkylbenzimidazole and an organic acid to form a corrosion and heat resistant protective coating SHIKOKU CHEMICALS CORPORATION (JP) 1992-12-22 US disclosed
EP-0428383-A1 Process for surface treatment of copper and copper alloy SHIKOKU CHEMICALS CORPORATION (JP) 1991-05-22 EP disclosed