SCHEMBL9720968

SCHEMBL9720968

CCCCCCCCc1nc2cc(Cl)c(Cl)cc2[nH]1

nearest known ligand 0.70

Predicted protein targets (top 17)

geneUniProtsupporting neighboursconfidence
GAA P10253 1/20 0.66
HTT P42858 1/20 0.66
PRKAG1 P54619 1/20 0.56
PRKAA2 P54646 1/20 0.56
PRKAA1 Q13131 1/20 0.56
PRKAB1 Q9Y478 1/20 0.56
CACNA1G O43497 1/20 0.50
CACNA1H O95180 1/20 0.50
PDE10A Q9Y233 1/20 0.49
MAPT P10636 2/20 0.49
PKM P14618 2/20 0.49
KDM4E B2RXH2 1/20 0.49
MEN1 O00255 1/20 0.49
KMT2A Q03164 1/20 0.49
TDP1 Q9NUW8 1/20 0.49
L3MBTL1 Q9Y468 1/20 0.49
GPR84 Q9NQS5 4/20 0.47

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL6757262 1.00 GAA (0.66) GAAHTTPRKAG1PRKAA2PRKAA1
SCHEMBL2951845 0.98 GAA (0.68) GAAHTTPRKAG1PRKAA2PRKAA1
SCHEMBL7559296 0.94 GAA (0.70) GAAHTTPRKAG1PRKAA2PRKAA1
SCHEMBL8637242 0.87 GAA (0.74) GAAHTTPRKAG1PRKAA2PRKAA1
SCHEMBL9288400 0.83 PRKAG1 (0.61) GAAHTTPRKAG1PRKAA2PRKAA1
SCHEMBL9720919 0.83 KMT2A (0.58) PDE10AMAPTPKMKDM4EMEN1
SCHEMBL19025143 0.83 KMT2A (0.58) PDE10AMAPTPKMKDM4EMEN1
SCHEMBL13804897 0.83 GAA (0.58) GAAHTTPRKAG1PRKAA2PRKAA1
SCHEMBL9721048 0.83 KMT2A (0.58) PDE10AMAPTPKMKDM4EMEN1
SCHEMBL9887037 0.82 GAA (0.58) GAAHTTPRKAG1PRKAA2PRKAA1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 3 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-5173130-A Immersing copper or alloy to be soldered in an aqueous solution containing a 2-alkylbenzimidazole and an organic acid to form a corrosion and heat resistant protective coating SHIKOKU CHEMICALS CORPORATION (JP) 1992-12-22 US claimed
US-5173130-A Immersing copper or alloy to be soldered in an aqueous solution containing a 2-alkylbenzimidazole and an organic acid to form a corrosion and heat resistant protective coating SHIKOKU CHEMICALS CORPORATION (JP) 1992-12-22 US disclosed
EP-0428383-A1 Process for surface treatment of copper and copper alloy SHIKOKU CHEMICALS CORPORATION (JP) 1991-05-22 EP disclosed