Sulfuric Acid

Sulfuric Acid

SCHEMBL9725602

CN(C)C1=CCC(=[N+]=[N-])C=C1.O=S(=O)(O)O

nearest known ligand 0.00

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Known targets — ChEMBL curated mechanism

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

The experimentally established mechanism targets of Sulfuric Acid. The predicted profile below is derived independently by chemical similarity — agreement is a validation signal, a miss is honest.

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL11147195 0.84
SCHEMBL11419490 0.83
Sulfuric Acid SCHEMBL9725585 0.83 MEN1 (0.30)
Sulfuric Acid SCHEMBL9170625 0.76 TSHR (0.39)
Sulfuric Acid SCHEMBL3902325 0.74
SCHEMBL9638261 0.71
SCHEMBL9725567 0.70
Sulfuric Acid SCHEMBL28447459 0.69
Hydrochloric Acid SCHEMBL28682434 0.69
Sulfuric Acid SCHEMBL28613267 0.69

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 10 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-4273842-A Process for forming patternwise coated powder layer HITACHI, LTD. (JP) 1981-06-16 US claimed
EP-3992254-B1 COMPOSITION, FILM, AND OPTICAL SENSOR FUJIFILM CORP (JP) 2024-02-21 EP disclosed
EP-4310556-A1 FILM AND PHOTOSENSOR FUJIFILM Corporation (JP) 2024-01-24 EP disclosed
EP-4130147-A1 COMPOSITION, FILM, AND OPTICAL SENSOR FUJIFILM Corporation (JP) 2023-02-08 EP disclosed
WO-2022196599-A1 FILM AND PHOTOSENSOR 富士フイルム株式会社 2022-09-22 WO disclosed
CN-114450098-A Method for manufacturing heat conductive layer, method for manufacturing laminate, and method for manufacturing semiconductor device 富士胶片株式会社 2022-05-06 CN disclosed
EP-3992254-A1 COMPOSITION, FILM, AND OPTICAL SENSOR FUJIFILM Corporation (JP) 2022-05-04 EP disclosed
WO-2019203178-A1 HEAT-CONDUCTING LAYER, PHOTOSENSITIVE LAYER, PHOTOSENSITIVE COMPOSITION, METHOD FOR PRODUCING HEAT-CONDUCTING LAYER, AND LAMINATE AND SEMICONDUCTOR DEVICE 富士フイルム株式会社 2019-10-24 WO disclosed
US-5173382-A Mixture of water soluble polyvinyl alcohol, gelatin and gum arabic and a an aroamtic diazonium chromate HITACHI, LTD. (JP) 1992-12-22 US disclosed
US-4273842-A Process for forming patternwise coated powder layer HITACHI, LTD. (JP) 1981-06-16 US disclosed