SCHEMBL9763984

SCHEMBL9763984

O=S(=O)(O)CCCc1nc2cc(S)ccc2s1

nearest known ligand 0.43

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
HDAC6 Q9UBN7 3/20 0.43
HTT P42858 2/20 0.42
SMN1; SMN2 Q16637 2/20 0.42
ALOX15 P16050 1/20 0.42
ALDH1A1 P00352 2/20 0.40
GAA P10253 1/20 0.40
KDM4E B2RXH2 1/20 0.38
TDP1 Q9NUW8 1/20 0.38
LMNA P02545 1/20 0.37
LOXL2 Q9Y4K0 1/20 0.36
HPGD P15428 3/20 0.36
PKM P14618 2/20 0.36
POLB P06746 1/20 0.36
ATM Q13315 1/20 0.36
DRD2 P14416 1/20 0.36
DRD4 P21917 1/20 0.36
DRD3 P35462 1/20 0.36
MAPT P10636 1/20 0.36
RAB9A P51151 1/20 0.35
MEN1 O00255 1/20 0.35

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1412767 0.80 SMN1; SMN2 (0.64) HTTSMN1; SMN2ALOX15ALDH1A1GAA
SCHEMBL5685105 0.74 STING1 (0.49) HDAC6HTTSMN1; SMN2ALOX15ALDH1A1
SCHEMBL9764327 0.74 HTT (0.41) HTTSMN1; SMN2ALOX15ALDH1A1GAA
SCHEMBL1574066 0.70 HDAC6 (0.36) HDAC6HTTSMN1; SMN2ALOX15ALDH1A1
SCHEMBL1412765 0.69 HTT (0.41) HTTSMN1; SMN2ALOX15ALDH1A1GAA
SCHEMBL1412620 0.67 SMN1; SMN2 (0.40) HTTSMN1; SMN2ALOX15ALDH1A1GAA
SCHEMBL1094971 0.66 NPC1 (0.35) SMN1; SMN2ALDH1A1GAAKDM4ELOXL2
SCHEMBL29595720 0.66 KDM4E (0.58) HTTSMN1; SMN2ALOX15ALDH1A1GAA
SCHEMBL10743928 0.65 MGLL (0.43)
SCHEMBL12844436 0.65 DYRK1A (0.49) HDAC6HTTSMN1; SMN2ALDH1A1GAA

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-5051154-A Copper salt, an electrolyte and an organic additive for modification of the charge transfer overpotential SHIPLEY COMPANY INC. (US) 1991-09-24 US claimed
EP-0440027-A2 Additive for acid-copper electroplating baths to increase throwing power SHIPLEY COMPANY INC. (US) 1991-08-07 EP claimed