Predicted protein targets (top 1)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | TSHR | P16473 | 1/20 | 0.33 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL28544581 | 0.82 | NPC1 (0.30) | — | |
| SCHEMBL28538164 | 0.76 | — | — | |
| SCHEMBL11542853 | 0.72 | TAAR1 (0.54) | TSHR | |
| SCHEMBL28448290 | 0.72 | CTSL (0.35) | — | |
| SCHEMBL9162557 | 0.71 | HTR2A (0.44) | — | |
| SCHEMBL28743217 | 0.71 | CTSL (0.34) | — | |
| SCHEMBL20590932 | 0.70 | TSHR (0.30) | TSHR | |
| SCHEMBL27548301 | 0.69 | TYR (0.43) | TSHR | |
| SCHEMBL28644198 | 0.68 | — | — | |
| SCHEMBL28855372 | 0.68 | TYR (0.43) | TSHR |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 56 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| JP-3027393-A | — | — | None | — | — | JP | disclosed |
| CN-118235089-A | Curable resin composition, laminated structure, cured product, and electronic component | 太阳控股株式会社 | 2024-06-21 | — | — | CN | disclosed |
| CN-118043739-A | Photosensitive resin composition, cured product, printed wiring board, and method for producing printed wiring board | 太阳控股株式会社 | 2024-05-14 | — | — | CN | disclosed |
| CN-113646698-B | Photoresist composition and cured product thereof | 太阳控股株式会社 | 2024-05-10 | — | — | CN | disclosed |
| CN-117999516-A | Photosensitive resin composition, dry film, cured product, and printed wiring board | 太阳控股株式会社 | 2024-05-07 | — | — | CN | disclosed |
| CN-117940471-A | Hot-melt curable polyorganosiloxane composition, cured product of the composition, and method for producing film or the like from the composition | 陶氏东丽株式会社 | 2024-04-26 | — | — | CN | disclosed |
| CN-113196171-B | Curable resin composition, dry film, cured product, and electronic component | 太阳控股株式会社 | 2024-04-23 | — | — | CN | disclosed |
| CN-117916280-A | Curable hot-melt silicone composition, cured product of the composition, and method for producing film or the like comprising the composition | 陶氏东丽株式会社 | 2024-04-19 | — | — | CN | disclosed |
| CN-117908328-A | Photosensitive resin composition, dry film, cured product, and printed wiring board | 太阳控股株式会社 | 2024-04-19 | — | — | CN | disclosed |
| CN-111708251-B | Curable resin composition, dry film, cured product, and electronic component | 太阳控股株式会社 | 2024-04-16 | — | — | CN | disclosed |
| CN-111936575-A | Curable resin composition, dry film, cured product, and electronic component | 太阳油墨制造株式会社 | 2020-11-13 | — | — | CN | disclosed |
| CN-111918933-A | Curable resin composition, dry film, cured product, laminated structure, and electronic component | 太阳油墨制造株式会社 | 2020-11-10 | — | — | CN | disclosed |
| CN-111913353-A | Curable resin composition, dry film, cured product, and printed wiring board | 太阳油墨制造株式会社 | 2020-11-10 | — | — | CN | disclosed |
| CN-111913354-A | Curable resin composition, dry film, cured product, and printed wiring board | 太阳油墨制造株式会社 | 2020-11-10 | — | — | CN | disclosed |
| CN-111742014-A | Resin composition for laminated electronic component, dry film, cured product, laminated electronic component, and printed wiring board | 太阳油墨制造株式会社 | 2020-10-02 | — | — | CN | disclosed |
| CN-111708251-A | Curable resin composition, dry film, cured product, and electronic component | 太阳油墨制造株式会社 | 2020-09-25 | — | — | CN | disclosed |
| CN-105739241-B | Curable resin composition, dry film, cured product, and printed wiring board | 太阳油墨制造株式会社 | 2020-08-14 | — | — | CN | disclosed |
| CN-106200266-B | Curable resin composition, dry film, cured product, and printed wiring board | 太阳油墨制造株式会社 | 2020-01-24 | — | — | CN | disclosed |
| CN-103869615-B | Photocurable composition, solder resist layer, and printed wiring board | 太阳油墨制造株式会社 | 2019-12-17 | — | — | CN | disclosed |
| JP-H0327393-A | NOVEL NITROGEN-CONTAINING TITANOCENE AND ITS USE | CIBA GEIGY AG | 1991-02-05 | — | — | JP | disclosed |