Silver

Silver

SCHEMBL978772

CC(C)(CO)C(=O)[O-].[Ag+]

nearest known ligand 0.00

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Known targets — ChEMBL curated mechanism

folP

The experimentally established mechanism targets of Silver. The predicted profile below is derived independently by chemical similarity — agreement is a validation signal, a miss is honest.

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Potassium Ion SCHEMBL7352758 0.94
Zinc Ion SCHEMBL29162954 0.94 CA2 (0.32)
SCHEMBL1816996 0.94
Lithium Ion SCHEMBL1765018 0.94
SCHEMBL3957769 0.94
Zinc Ion SCHEMBL31407856 0.92 CA2 (0.31)
SCHEMBL31407802 0.92 CA2 (0.36)
Dimebutic Acid SCHEMBL13517329 0.77
Silver SCHEMBL979870 0.77 CYP2D6 (0.32)
Silver SCHEMBL6739447 0.74 CA4 (0.46)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-7875214-B2 A mixture of silver oxide and a silver salt of a hydroxy(s)-containng fatty acid composition. Coating on a substrate of low heat resistance such as Polyethylene Terephthalate and subjected to a low temperature and short-time heat treatment to effect chemical reduction;printed circuits THE YOKOHAMA RUBBER CO., LTD. (JP) 2011-01-25 US claimed
US-20090085015-A1 ELECTROCONDUCTIVE COMPOSITION, METHOD FOR FORMING ELECTROCONDUCTIVE FILM, AND ELECTROCONDUCTIVE FILM THE YOKOHAMA RUBBER CO., LTD. (JP) 2009-04-02 US claimed
US-7875214-B2 A mixture of silver oxide and a silver salt of a hydroxy(s)-containng fatty acid composition. Coating on a substrate of low heat resistance such as Polyethylene Terephthalate and subjected to a low temperature and short-time heat treatment to effect chemical reduction;printed circuits THE YOKOHAMA RUBBER CO., LTD. (JP) 2011-01-25 US disclosed
US-20090085015-A1 ELECTROCONDUCTIVE COMPOSITION, METHOD FOR FORMING ELECTROCONDUCTIVE FILM, AND ELECTROCONDUCTIVE FILM THE YOKOHAMA RUBBER CO., LTD. (JP) 2009-04-02 US disclosed