SCHEMBL9802843

SCHEMBL9802843

C=CCNC(=O)C1CC2C=CC1C2

nearest known ligand 0.57

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
LMNA P02545 2/20 0.57
KDM4E B2RXH2 1/20 0.57
KMT2A Q03164 3/20 0.47
THRB P10828 1/20 0.42
ALDH1A1 P00352 4/20 0.40
EPHX2 P34913 2/20 0.39
POLB P06746 2/20 0.38
APEX1 P27695 1/20 0.38
RECQL P46063 1/20 0.38
BLM P54132 1/20 0.38
ESR2 Q92731 1/20 0.38
HSD17B10 Q99714 1/20 0.38
TDP1 Q9NUW8 1/20 0.38
L3MBTL1 Q9Y468 1/20 0.38
HPGD P15428 1/20 0.38
RAB9A P51151 2/20 0.38
NPC1 O15118 1/20 0.38
NFKB1 P19838 1/20 0.38
NFKB2 Q00653 1/20 0.38
RELA Q04206 1/20 0.38

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL6137154 0.80 KDM4E (0.65) LMNAKDM4EKMT2ATHRBALDH1A1
SCHEMBL5349832 0.78 KDM4E (0.62) LMNAKDM4EKMT2ATHRBALDH1A1
SCHEMBL11064769 0.77 KDM4E (0.61) LMNAKDM4EKMT2ATHRBALDH1A1
SCHEMBL11064771 0.77 KDM4E (0.61) LMNAKDM4EKMT2ATHRBALDH1A1
SCHEMBL10124090 0.75 KDM4E (0.59) LMNAKDM4EKMT2ATHRBALDH1A1
SCHEMBL9924679 0.75 KDM4E (0.59) LMNAKDM4EKMT2ATHRBALDH1A1
SCHEMBL14392991 0.75 KDM4E (0.59) LMNAKDM4EKMT2ATHRBALDH1A1
SCHEMBL24403596 0.74 KDM4E (0.57) LMNAKDM4EKMT2ATHRBALDH1A1
SCHEMBL14489328 0.74 KDM4E (0.57) LMNAKDM4EKMT2ATHRBALDH1A1
SCHEMBL5068281 0.74 ALDH1A1 (0.45) LMNAKDM4EKMT2ATHRBALDH1A1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-4992518-A Heat-resistant adhesives; matrix resins; dielectrics; composites; lamination CIBA-GEIGY CORPORATION (US) 1991-02-12 US disclosed
US-4992518-A Heat-resistant adhesives; matrix resins; dielectrics; composites; lamination CIBA-GEIGY CORPORATION (US) 1991-02-12 US disclosed
US-4861885-A Allylbicyclo[2.2.1]hept-5-ene-2-carboxylic acid amides CIBA-GEIGY CORPORATION (US) 1989-08-29 US disclosed
US-4861885-A Allylbicyclo[2.2.1]hept-5-ene-2-carboxylic acid amides CIBA-GEIGY CORPORATION (US) 1989-08-29 US disclosed