SCHEMBL980761

SCHEMBL980761

CCCCCC(C)CCC[O]

nearest known ligand 0.54

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ACE2 Q9BYF1 1/20 0.54
OPRM1 P35372 1/20 0.46
LMNA P02545 2/20 0.43
CA1 P00915 2/20 0.43
TP53 P04637 1/20 0.41
ADH1B P00325 1/20 0.40
ADH1C P00326 1/20 0.40
ADH1A P07327 1/20 0.40
ADH4 P08319 1/20 0.40
ADH7 P40394 1/20 0.40
FDPS P14324 4/20 0.39
GPR84 Q9NQS5 3/20 0.38
SPHK1 Q9NYA1 1/20 0.38
FFAR1 O14842 1/20 0.38
PRKD3 O94806 1/20 0.38
PRKCG P05129 1/20 0.38
PRKCB P05771 1/20 0.38
PRKCA P17252 1/20 0.38
PRKCH P24723 1/20 0.38
PRKCI P41743 1/20 0.38

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL27394455 0.97 ACE2 (0.57) ACE2OPRM1LMNACA1TP53
SCHEMBL22749072 0.97 ACE2 (0.57) ACE2OPRM1LMNACA1TP53
SCHEMBL28025529 0.97 ACE2 (0.57) ACE2OPRM1LMNACA1TP53
SCHEMBL28025558 0.97 ACE2 (0.57) ACE2OPRM1LMNACA1TP53
SCHEMBL28025470 0.97 ACE2 (0.57) ACE2OPRM1LMNACA1TP53
SCHEMBL28896926 0.92 ACE2 (0.57) ACE2OPRM1LMNACA1TP53
SCHEMBL978822 0.92 ACE2 (0.45) ACE2OPRM1LMNACA1TP53
SCHEMBL979911 0.90 ACE2 (0.54) ACE2OPRM1LMNACA1TP53
SCHEMBL978906 0.90 ACE2 (0.48) ACE2OPRM1LMNACA1TP53
SCHEMBL5687304 0.87 ACE2 (0.57) ACE2OPRM1LMNACA1TP53

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 8 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2023223888-A1 METHOD FOR PRODUCING POLYCARBONATE RESIN, AND ALICYCLIC POLYCARBONATE RESIN 旭化成株式会社 2023-11-23 WO disclosed
CN-109721723-B Surfactant, method for producing the same, and solution containing the same 中日合成化学股份有限公司 2021-07-06 CN disclosed
US-20110001221-A1 DIELECTRIC LAYER INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE (TW) 2011-01-06 US disclosed
US-7829137-B2 Fabricating dielectric layer INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE (TW) 2010-11-09 US disclosed
US-20070172583-A1 DIELECTRIC LAYER, COMPOSITION AND METHOD FOR FORMING THE SAME INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE (TW) 2007-07-26 US disclosed
US-7067179-B1 Fused ring compound DAINIPPON INK AND CHEMICALS, INC. (JP) 2006-06-27 US disclosed
EP-1201632-B1 FUSED RING COMPOUND DAINIPPON INK & CHEMICALS (JP) 2006-03-29 EP disclosed
EP-1201632-A1 FUSED RING COMPOUND DAINIPPON INK AND CHEMICALS, INC. (JP) 2002-05-02 EP disclosed