SCHEMBL9851953

SCHEMBL9851953

CCCC(O)(Cl)Cl

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL9114309 0.81
SCHEMBL10758807 0.80
SCHEMBL9180025 0.79
SCHEMBL5833810 0.78
SCHEMBL16970026 0.76 FDPS (0.38)
SCHEMBL16970302 0.76 FDPS (0.38)
SCHEMBL11469008 0.76
SCHEMBL1484701 0.76 FDPS (0.48)
SCHEMBL16969827 0.76 FDPS (0.48)
SCHEMBL16970300 0.76 FDPS (0.48)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 10 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-110819265-A Acrylate structural adhesive 北京天山新材料技术有限公司 2020-02-21 CN disclosed
US-9856229-B2 Method for producing cyclic carbonate NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY (JP) 2018-01-02 US disclosed
EP-2905349-B1 Ag ball, solder joint, formed solder, solder paste and silver paste SENJU METAL INDUSTRY CO (JP) 2017-05-17 EP disclosed
US-20160145234-A1 METHOD FOR PRODUCING CYCLIC CARBONATE NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY (JP) 2016-05-26 US disclosed
EP-3023418-A1 METHOD FOR MANUFACTURING CYCLIC CARBONATE National Institute of Advanced Industrial Science and Technology (JP) 2016-05-25 EP disclosed
US-9266196-B2 Ag ball, ag core ball, flux-coated ag ball, flux-coated ag core ball, solder joint, formed solder, solder paste and ag paste SENJU METAL INDUSTRY CO., LTD. (JP) 2016-02-23 US disclosed
EP-2905349-A2 Ag ball, Ag core ball, flux-coated Ag ball, flux-coated Ag core ball, solder joint, formed solder, solder paste and Ag paste SENJU METAL INDUSTRY CO., LTD. (JP) 2015-08-12 EP disclosed
US-20150217409-A1 Ag BALL, Ag CORE BALL, FLUX-COATED Ag BALL, FLUX-COATED Ag CORE BALL, SOLDER JOINT, FORMED SOLDER, SOLDER PASTE AND Ag PASTE Senju Metal lndustry Co., Ltd. (JP) 2015-08-06 US disclosed
EP-0415704-A2 Catalysts for polymerization of olefins CHISSO CORPORATION (JP) 1991-03-06 EP disclosed
US-4226264-A Elastic amylose polymers TEEPAK, INC. (US) 1980-10-07 US disclosed