Predicted protein targets (top 10)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | MEN1 | O00255 | 1/20 | 0.34 |
| ▸ | MAPT | P10636 | 1/20 | 0.34 |
| ▸ | KMT2A | Q03164 | 1/20 | 0.34 |
| ▸ | ATM | Q13315 | 1/20 | 0.34 |
| ▸ | L3MBTL1 | Q9Y468 | 1/20 | 0.34 |
| ▸ | CES2 | O00748 | 1/20 | 0.33 |
| ▸ | SMPD1 | P17405 | 3/20 | 0.32 |
| ▸ | FDPS | P14324 | 8/20 | 0.32 |
| ▸ | GGPS1 | O95749 | 5/20 | 0.32 |
| ▸ | NAAA | Q02083 | 1/20 | 0.32 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL989025 | 0.92 | MEN1 (0.32) | MEN1MAPTKMT2AATML3MBTL1 | |
| SCHEMBL2119083 | 0.83 | MEN1 (0.33) | MEN1MAPTKMT2AATML3MBTL1 | |
| SCHEMBL7937641 | 0.77 | MEN1 (0.35) | MEN1MAPTKMT2AATML3MBTL1 | |
| SCHEMBL17939775 | 0.77 | MEN1 (0.36) | MEN1MAPTKMT2AATML3MBTL1 | |
| SCHEMBL28608096 | 0.75 | PAM (0.31) | — | |
| SCHEMBL27287130 | 0.74 | TSHR (0.37) | CES2SMPD1FDPSGGPS1 | |
| SCHEMBL2125403 | 0.74 | MEN1 (0.38) | MEN1MAPTKMT2AATML3MBTL1 | |
| SCHEMBL141053 | 0.74 | MEN1 (0.40) | MEN1MAPTKMT2AATML3MBTL1 | |
| SCHEMBL15657365 | 0.72 | — | — | |
| SCHEMBL15660674 | 0.71 | TSHR (0.32) | MEN1MAPTKMT2AATML3MBTL1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 9 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-9793103-B2 | Epoxy-based composition, adhesive film, dicing die-bonding film and semiconductor device | LG CHEM, LTD. (KR) | 2017-10-17 | — | — | US | disclosed |
| US-9659763-B2 | Epoxy-based composition, adhesive film, dicing die-bonding film and semiconductor device | LG CHEM, LTD. (KR) | 2017-05-23 | — | — | US | disclosed |
| CN-102015953-B | Epoxy-based composition, adhesive film, dicing die-bonding film and semiconductor device | LG CHEMICAL LTD | 2015-01-14 | — | — | CN | disclosed |
| EP-2270112-B1 | EPOXY-BASED COMPOSITION, ADHESIVE FILM, DICING DIE-BONDING FILM AND SEMICONDUCTOR DEVICE | LG CHEMICAL LTD (KR) | 2014-08-13 | — | — | EP | disclosed |
| US-20130281571-A1 | EPOXY-BASED COMPOSITION, ASHESIVE FILM, DICING DIE-BONDING FILM AND SEMICONDUCTOR DEVICE | LG CHEM, LTD. (KR) | 2013-10-24 | — | — | US | disclosed |
| US-20110111218-A1 | EPOXY-BASED COMPOSITION, ADHESIVE FILM, DICING DIE-BONDING FILM AND SEMICONDUCTOR DEVICE | LG CHEM, LTD. (KR) | 2011-05-12 | — | — | US | disclosed |
| CN-102015953-A | Epoxy-based composition, adhesive film, dicing die-bonding film and semiconductor device | LG CHEMICAL LTD | 2011-04-13 | — | — | CN | disclosed |
| EP-2270112-A2 | EPOXY-BASED COMPOSITION, ADHESIVE FILM, DICING DIE-BONDING FILM AND SEMICONDUCTOR DEVICE | LG Chem, Ltd. (KR) | 2011-01-05 | — | — | EP | disclosed |
| US-4181788-A | Process for the production of thermoplastic molding materials based on vinyl polymers | BAYER AKTIENGESELLSCHAFT (DE) | 1980-01-01 | — | — | US | disclosed |