⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL13788819 | 0.85 | — | — | |
| SCHEMBL13210314 | 0.81 | — | — | |
| SCHEMBL22555957 | 0.81 | — | — | |
| SCHEMBL133734 | 0.79 | — | — | |
| SCHEMBL12209675 | 0.78 | — | — | |
| SCHEMBL8351332 | 0.78 | — | — | |
| SCHEMBL4761256 | 0.78 | — | — | |
| SCHEMBL11950506 | 0.78 | — | — | |
| SCHEMBL9178213 | 0.78 | — | — | |
| SCHEMBL3868343 | 0.78 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 35 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-10040924-B2 | Adhesion promoter, addition curable organopolysiloxane resin composition and semiconductor apparatus | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2018-08-07 | — | — | US | disclosed |
| US-9890251-B2 | Hydrosilyl-containing organopolysiloxane, making method, addition curable silicone composition, and semiconductor package | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2018-02-13 | — | — | US | disclosed |
| US-20180025958-A1 | BASE-ATTACHED ENCAPSULANT FOR SEMICONDUCTOR ENCAPSULATION, SEMICONDUCTOR APPARATUS, AND METHOD FOR MANUFACTURING SEMICONDUCTOR APPARATUS | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2018-01-25 | — | — | US | disclosed |
| US-9865518-B2 | Electromagnetic wave shielding support base-attached encapsulant, encapsulated substrate having semicondutor devices mounted thereon, encapsulated wafer having semiconductor devices formed thereon, and semiconductor apparatus | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2018-01-09 | — | — | US | disclosed |
| US-20170330813-A1 | BASE-ATTACHED ENCAPSULANT FOR SEMICONDUCTOR ENCAPSULATION, SEMICONDUCTOR APPARATUS, AND METHOD FOR MANUFACTURING SEMICONDUCTOR APPARATUS | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2017-11-16 | — | — | US | disclosed |
| US-20170282527-A1 | VACUUM LAMINATING APPARATUS AND METHOD FOR MANUFACTURING SEMICONDUCTOR APPARATUS | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2017-10-05 | — | — | US | disclosed |
| US-20170121504-A1 | ADHESION PROMOTER, ADDITION CURABLE ORGANOPOLYSILOXANE RESIN COMPOSITION AND SEMICONDUCTOR APPARATUS | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2017-05-04 | — | — | US | disclosed |
| US-20170110415-A1 | METHOD FOR MANUFACTURING SEMICONDUCTOR APPARATUS AND SEMICONDUCTOR APPARATUS | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2017-04-20 | — | — | US | disclosed |
| US-20170098551-A1 | BASE-ATTACHED ENCAPSULANT FOR SEMICONDUCTOR ENCAPSULATION, METHOD FOR MANUFACTURING BASE-ATTACHED ENCAPSULANT FOR SEMICONDUCTOR ENCAPSULATION, AND METHOD FOR MANUFACTURING SEMICONDUCTOR APPARATUS | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2017-04-06 | — | — | US | disclosed |
| US-20170029571-A1 | HYDROSILYL-CONTAINING ORGANOPOLYSILOXANE, MAKING METHOD, ADDITION CURABLE SILICONE COMPOSITION, AND SEMICONDUCTOR PACKAGE | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2017-02-02 | — | — | US | disclosed |
| US-20130200534-A1 | SEALANT LAMINATED COMPOSITE, SEALED SEMICONDUCTOR DEVICES MOUNTING SUBSTRATE, SEALED SEMICONDUCTOR DEVICES FORMING WAFER, SEMICONDUCTOR APPARATUS, AND METHOD FOR MANUFACTURING SEMICONDUCTOR APPARATUS | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2013-08-08 | — | — | US | disclosed |
| US-8440776-B2 | Lens-forming silicone resin composition and silicone lens | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2013-05-14 | — | — | US | disclosed |
| US-8420762-B2 | Silicone resin composition and a cured product thereof | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2013-04-16 | — | — | US | disclosed |
| US-20130072592-A1 | METHOD OF PRODUCING CURED THIN FILM USING PHOTOCURABLE SILICONE RESIN COMPOSITION | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2013-03-21 | — | — | US | disclosed |
| US-20120161339-A1 | FIBER-CONTAINING RESIN SUBSTRATE, SEALED SUBSTRATE HAVING SEMICONDUCTOR DEVICE MOUNTED THEREON, SEALED WAFER HAVING SEMICONDUCTOR DEVICE FORMED THEREON, A SEMICONDUCTOR APPARATUS, AND METHOD FOR MANUFACTURING SEMICONDUCTOR APPARATUS | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2012-06-28 | — | — | US | disclosed |
| US-20120142803-A1 | METHOD FOR CURING A SILICONE RESIN COMPOSITION | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2012-06-07 | — | — | US | disclosed |
| US-20120043577-A1 | CURABLE SILICONE RESIN COMPOSITION AND LIGHT-EMITTING DIODE DEVICE USING THE SAME | SHIN-ETSU CEMICAL CO., LTD. (JP) | 2012-02-23 | — | — | US | disclosed |
| US-20110147955-A1 | SILICONE RESIN COMPOSITION AND A CURED PRODUCT THEREOF | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2011-06-23 | — | — | US | disclosed |
| US-20110140289-A1 | RESIN COMPOSITION FOR ENCAPSULATING OPTICAL SEMICONDUCTOR ELEMENT AND OPTICAL SEMICONDUCTOR DEVICE | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2011-06-16 | — | — | US | disclosed |
| US-20100197870-A1 | LENS-FORMING SILICONE RESIN COMPOSITION AND SILICONE LENS | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2010-08-05 | — | — | US | disclosed |