SCHEMBL989614

SCHEMBL989614

CCOc1cc(/C=C/c2nc(C(Cl)(Cl)Cl)nc(C(Cl)(Cl)Cl)n2)ccc1OC

nearest known ligand 0.47

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
TUBB1 Q9H4B7 6/20 0.47
MAPT P10636 5/20 0.47
LMNA P02545 3/20 0.47
ALDH1A1 P00352 2/20 0.47
SMN1; SMN2 Q16637 2/20 0.47
NPC1 O15118 2/20 0.47
RAB9A P51151 2/20 0.47
AMY1A P0DUB6 1/20 0.45
TUBB4A P04350 2/20 0.45
TUBB P07437 2/20 0.45
TUBA3C P0DPH7 2/20 0.45
TUBA1B P68363 2/20 0.45
TUBA4A P68366 2/20 0.45
TUBB4B P68371 2/20 0.45
TUBB3 Q13509 2/20 0.45
TUBB2A Q13885 2/20 0.45
TUBB8 Q3ZCM7 2/20 0.45
TUBA3E Q6PEY2 2/20 0.45
TUBA1A Q71U36 2/20 0.45
TUBA1C Q9BQE3 2/20 0.45

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL989615 1.00 TUBB1 (0.47) TUBB1MAPTLMNAALDH1A1SMN1; SMN2
SCHEMBL990313 0.95 TUBB1 (0.47) TUBB1MAPTLMNAALDH1A1SMN1; SMN2
SCHEMBL990314 0.95 TUBB1 (0.47) TUBB1MAPTLMNAALDH1A1SMN1; SMN2
SCHEMBL990381 0.94 KMT2A (0.42) TUBB1MAPTLMNAALDH1A1SMN1; SMN2
SCHEMBL990380 0.94 KMT2A (0.42) TUBB1MAPTLMNAALDH1A1SMN1; SMN2
SCHEMBL990955 0.90 TUBB1 (0.49) TUBB1MAPTLMNAALDH1A1SMN1; SMN2
SCHEMBL990956 0.90 TUBB1 (0.49) TUBB1MAPTLMNAALDH1A1SMN1; SMN2
SCHEMBL151091 0.90 MAPT (0.53) TUBB1MAPTLMNAALDH1A1SMN1; SMN2
SCHEMBL29363338 0.90 MAPT (0.53) TUBB1MAPTLMNAALDH1A1SMN1; SMN2
SCHEMBL151090 0.90 MAPT (0.53) TUBB1MAPTLMNAALDH1A1SMN1; SMN2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 13 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-1687678-B1 CHEMICALLY AMPLIFIED POSITIVE PHOTOSENSITIVE THERMOSETTING RESIN COMPOSITION, METHOD OF FORMING CURED ARTICLE AND USE OF THE METHOD FOR PRODUCING FUNCTIONAL DEVICE TOKYO OHKA KOGYO CO LTD (JP) 2013-07-31 EP disclosed
US-7871756-B2 Chemically amplified positive photosensitive thermosetting resin composition, method of forming cured article, and method of producing functional device TOKYO OHKA KOGYO CO., LTD. (JP) 2011-01-18 US disclosed
US-7816072-B2 Positive resist composition and method for forming resist pattern TOKYO OHKA KOGYO CO., LTD. (JP) 2010-10-19 US disclosed
US-20090081590-A1 NEGATIVE RESIST COMPOSITION AND PROCESS FOR FORMING RESIST PATTERNS TOKYO OHKA KOGYO CO., LTD. (JP) 2009-03-26 US disclosed
US-20090068594-A1 POSITIVE RESIST COMPOSITION AND METHOD FOR FORMING RESIST PATTERN TOKYO OHKA KOGYO CO., LTD. (JP) 2009-03-12 US disclosed
US-7358028-B2 Chemically amplified positive photo resist composition and method for forming resist pattern TOKYO OHKA KOGYO CO., LTD. (JP) 2008-04-15 US disclosed
US-20080044764-A1 Chemically Amplified Positive Photosensitive Thermosetting Resin Composition, Method Of Forming Cured Article, And Method Of Producing Functional Device TOKYO OHKA KOGYO CO., LTD. (JP) 2008-02-21 US disclosed
US-7329478-B2 Chemical amplified positive photo resist composition and method for forming resist pattern TOKYO OHKA KOGYO CO., LTD. (JP) 2008-02-12 US disclosed
US-20070117045-A1 CHEMICAL AMPLIFICATION TYPE POSITIVE PHOTORESIST COMPOSITION AND RESIST PATTERN FORMING METHOD TOKYO OHKA KOGYO CO., LTD. (JP) 2007-05-24 US disclosed
US-7105265-B2 Method for removing resist pattern TOKYO OHKA KOGYO CO., LTD. (JP) 2006-09-12 US disclosed
US-20060003260-A1 Chemical amplified positive photo resist composition and method for forming resist pattern TOKYO OHKA KOGYO CO., LTD. (JP) 2006-01-05 US disclosed
US-20050244740-A1 Chemically amplified positive photo resist composition and method for forming resist pattern TOKYO OHKA KOGYO CO., LTD. (JP) 2005-11-03 US disclosed
US-20050130055-A1 Method and removing resist pattern TOKYO OHKA KOGYO CO., LTD. (JP) 2005-06-16 US disclosed