SCHEMBL990380

SCHEMBL990380

CCOc1ccc(/C=C/c2nc(C(Cl)(Cl)Cl)nc(C(Cl)(Cl)Cl)n2)cc1OCC

nearest known ligand 0.43

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
KMT2A Q03164 4/20 0.42
KDM4E B2RXH2 3/20 0.42
GAA P10253 3/20 0.42
MEN1 O00255 3/20 0.42
TUBB1 Q9H4B7 3/20 0.41
LMNA P02545 2/20 0.41
TOP2A P11388 2/20 0.41
POLB P06746 2/20 0.41
TACR2 P21452 1/20 0.40
ALDH1A1 P00352 4/20 0.39
MAPT P10636 3/20 0.39
SMN1; SMN2 Q16637 2/20 0.39
NPC1 O15118 2/20 0.39
RAB9A P51151 2/20 0.39
ABL1 P00519 1/20 0.39
ABCB1 P08183 1/20 0.39
BCR P11274 1/20 0.39
TUBB4A P04350 1/20 0.39
TUBB P07437 1/20 0.39
TUBA3C P0DPH7 1/20 0.39

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL990381 1.00 KMT2A (0.42) KMT2AKDM4EGAAMEN1TUBB1
SCHEMBL992272 0.94 KMT2A (0.44) KMT2AKDM4EGAAMEN1TUBB1
SCHEMBL990502 0.94 KMT2A (0.44) KMT2AKDM4EGAAMEN1TUBB1
SCHEMBL992271 0.94 KMT2A (0.44) KMT2AKDM4EGAAMEN1TUBB1
SCHEMBL990501 0.94 KMT2A (0.44) KMT2AKDM4EGAAMEN1TUBB1
SCHEMBL990313 0.94 TUBB1 (0.47) KMT2AGAAMEN1TUBB1LMNA
SCHEMBL989615 0.94 TUBB1 (0.47) KMT2AKDM4EGAAMEN1TUBB1
SCHEMBL989614 0.94 TUBB1 (0.47) KMT2AKDM4EGAAMEN1TUBB1
SCHEMBL990314 0.94 TUBB1 (0.47) KMT2AGAAMEN1TUBB1LMNA
SCHEMBL991223 0.90 KDM4E (0.44) KMT2AKDM4EGAAMEN1TUBB1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 13 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-1687678-B1 CHEMICALLY AMPLIFIED POSITIVE PHOTOSENSITIVE THERMOSETTING RESIN COMPOSITION, METHOD OF FORMING CURED ARTICLE AND USE OF THE METHOD FOR PRODUCING FUNCTIONAL DEVICE TOKYO OHKA KOGYO CO LTD (JP) 2013-07-31 EP disclosed
US-7871756-B2 Chemically amplified positive photosensitive thermosetting resin composition, method of forming cured article, and method of producing functional device TOKYO OHKA KOGYO CO., LTD. (JP) 2011-01-18 US disclosed
US-7816072-B2 Positive resist composition and method for forming resist pattern TOKYO OHKA KOGYO CO., LTD. (JP) 2010-10-19 US disclosed
US-20090081590-A1 NEGATIVE RESIST COMPOSITION AND PROCESS FOR FORMING RESIST PATTERNS TOKYO OHKA KOGYO CO., LTD. (JP) 2009-03-26 US disclosed
US-20090068594-A1 POSITIVE RESIST COMPOSITION AND METHOD FOR FORMING RESIST PATTERN TOKYO OHKA KOGYO CO., LTD. (JP) 2009-03-12 US disclosed
US-7358028-B2 Chemically amplified positive photo resist composition and method for forming resist pattern TOKYO OHKA KOGYO CO., LTD. (JP) 2008-04-15 US disclosed
US-20080044764-A1 Chemically Amplified Positive Photosensitive Thermosetting Resin Composition, Method Of Forming Cured Article, And Method Of Producing Functional Device TOKYO OHKA KOGYO CO., LTD. (JP) 2008-02-21 US disclosed
US-7329478-B2 Chemical amplified positive photo resist composition and method for forming resist pattern TOKYO OHKA KOGYO CO., LTD. (JP) 2008-02-12 US disclosed
US-20070117045-A1 CHEMICAL AMPLIFICATION TYPE POSITIVE PHOTORESIST COMPOSITION AND RESIST PATTERN FORMING METHOD TOKYO OHKA KOGYO CO., LTD. (JP) 2007-05-24 US disclosed
US-7105265-B2 Method for removing resist pattern TOKYO OHKA KOGYO CO., LTD. (JP) 2006-09-12 US disclosed
US-20060003260-A1 Chemical amplified positive photo resist composition and method for forming resist pattern TOKYO OHKA KOGYO CO., LTD. (JP) 2006-01-05 US disclosed
US-20050244740-A1 Chemically amplified positive photo resist composition and method for forming resist pattern TOKYO OHKA KOGYO CO., LTD. (JP) 2005-11-03 US disclosed
US-20050130055-A1 Method and removing resist pattern TOKYO OHKA KOGYO CO., LTD. (JP) 2005-06-16 US disclosed