SCHEMBL992275

SCHEMBL992275

CCCOc1ccc(/C=C/c2nc(C(Cl)(Cl)Cl)nc(C(Cl)(Cl)Cl)n2)cc1OC

nearest known ligand 0.53

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
KDM4E B2RXH2 2/20 0.53
PRKCE Q02156 2/20 0.47
PRKCQ Q04759 2/20 0.47
PRKCD Q05655 2/20 0.47
TUBB1 Q9H4B7 3/20 0.47
TUBB4A P04350 1/20 0.47
TUBB P07437 1/20 0.47
TUBA3C P0DPH7 1/20 0.47
TUBA1B P68363 1/20 0.47
TUBA4A P68366 1/20 0.47
TUBB4B P68371 1/20 0.47
TUBB3 Q13509 1/20 0.47
TUBB2A Q13885 1/20 0.47
TUBB8 Q3ZCM7 1/20 0.47
TUBA3E Q6PEY2 1/20 0.47
TUBA1A Q71U36 1/20 0.47
TUBA1C Q9BQE3 1/20 0.47
TUBB6 Q9BUF5 1/20 0.47
TUBB2B Q9BVA1 1/20 0.47
FDPS P14324 6/20 0.45

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL992277 1.00 KDM4E (0.53) KDM4EPRKCEPRKCQPRKCDTUBB1
SCHEMBL990956 0.95 TUBB1 (0.49) KDM4EPRKCEPRKCQPRKCDTUBB1
SCHEMBL990955 0.95 TUBB1 (0.49) KDM4EPRKCEPRKCQPRKCDTUBB1
SCHEMBL991222 0.94 KDM4E (0.44) KDM4EPRKCEPRKCQPRKCDTUBB1
SCHEMBL991223 0.94 KDM4E (0.44) KDM4EPRKCEPRKCQPRKCDTUBB1
SCHEMBL990501 0.91 KMT2A (0.44) KDM4EPRKCEPRKCQPRKCDTUBB1
SCHEMBL992271 0.91 KMT2A (0.44) KDM4EPRKCEPRKCQPRKCDTUBB1
SCHEMBL990502 0.91 KMT2A (0.44) KDM4EPRKCEPRKCQPRKCDTUBB1
SCHEMBL992272 0.91 KMT2A (0.44) KDM4EPRKCEPRKCQPRKCDTUBB1
SCHEMBL990313 0.90 TUBB1 (0.47) PRKCEPRKCQPRKCDTUBB1TUBB4A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 13 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-1687678-B1 CHEMICALLY AMPLIFIED POSITIVE PHOTOSENSITIVE THERMOSETTING RESIN COMPOSITION, METHOD OF FORMING CURED ARTICLE AND USE OF THE METHOD FOR PRODUCING FUNCTIONAL DEVICE TOKYO OHKA KOGYO CO LTD (JP) 2013-07-31 EP disclosed
US-7871756-B2 Chemically amplified positive photosensitive thermosetting resin composition, method of forming cured article, and method of producing functional device TOKYO OHKA KOGYO CO., LTD. (JP) 2011-01-18 US disclosed
US-7816072-B2 Positive resist composition and method for forming resist pattern TOKYO OHKA KOGYO CO., LTD. (JP) 2010-10-19 US disclosed
US-20090081590-A1 NEGATIVE RESIST COMPOSITION AND PROCESS FOR FORMING RESIST PATTERNS TOKYO OHKA KOGYO CO., LTD. (JP) 2009-03-26 US disclosed
US-20090068594-A1 POSITIVE RESIST COMPOSITION AND METHOD FOR FORMING RESIST PATTERN TOKYO OHKA KOGYO CO., LTD. (JP) 2009-03-12 US disclosed
US-7358028-B2 Chemically amplified positive photo resist composition and method for forming resist pattern TOKYO OHKA KOGYO CO., LTD. (JP) 2008-04-15 US disclosed
US-20080044764-A1 Chemically Amplified Positive Photosensitive Thermosetting Resin Composition, Method Of Forming Cured Article, And Method Of Producing Functional Device TOKYO OHKA KOGYO CO., LTD. (JP) 2008-02-21 US disclosed
US-7329478-B2 Chemical amplified positive photo resist composition and method for forming resist pattern TOKYO OHKA KOGYO CO., LTD. (JP) 2008-02-12 US disclosed
US-20070117045-A1 CHEMICAL AMPLIFICATION TYPE POSITIVE PHOTORESIST COMPOSITION AND RESIST PATTERN FORMING METHOD TOKYO OHKA KOGYO CO., LTD. (JP) 2007-05-24 US disclosed
US-7105265-B2 Method for removing resist pattern TOKYO OHKA KOGYO CO., LTD. (JP) 2006-09-12 US disclosed
US-20060003260-A1 Chemical amplified positive photo resist composition and method for forming resist pattern TOKYO OHKA KOGYO CO., LTD. (JP) 2006-01-05 US disclosed
US-20050244740-A1 Chemically amplified positive photo resist composition and method for forming resist pattern TOKYO OHKA KOGYO CO., LTD. (JP) 2005-11-03 US disclosed
US-20050130055-A1 Method and removing resist pattern TOKYO OHKA KOGYO CO., LTD. (JP) 2005-06-16 US disclosed