SCHEMBL990501

SCHEMBL990501

CCCOc1ccc(/C=C/c2nc(C(Cl)(Cl)Cl)nc(C(Cl)(Cl)Cl)n2)cc1OCC

nearest known ligand 0.44

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
KMT2A Q03164 5/20 0.44
MEN1 O00255 4/20 0.44
MAPT P10636 2/20 0.44
KDM4E B2RXH2 2/20 0.44
GAA P10253 1/20 0.44
POLB P06746 1/20 0.42
ALDH1A1 P00352 3/20 0.42
TDP1 Q9NUW8 3/20 0.42
SMN1; SMN2 Q16637 1/20 0.42
HPGD P15428 3/20 0.39
L3MBTL1 Q9Y468 2/20 0.39
TUBB1 Q9H4B7 5/20 0.39
TUBB4A P04350 1/20 0.39
TUBB P07437 1/20 0.39
TUBA3C P0DPH7 1/20 0.39
TUBA1B P68363 1/20 0.39
TUBA4A P68366 1/20 0.39
TUBB4B P68371 1/20 0.39
TUBB3 Q13509 1/20 0.39
TUBB2A Q13885 1/20 0.39

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL990502 1.00 KMT2A (0.44) KMT2AMEN1MAPTKDM4EGAA
SCHEMBL992272 1.00 KMT2A (0.44) KMT2AMEN1MAPTKDM4EGAA
SCHEMBL992271 1.00 KMT2A (0.44) KMT2AMEN1MAPTKDM4EGAA
SCHEMBL991223 0.96 KDM4E (0.44) KMT2AMEN1MAPTKDM4EGAA
SCHEMBL991222 0.96 KDM4E (0.44) KMT2AMEN1MAPTKDM4EGAA
SCHEMBL990380 0.94 KMT2A (0.42) KMT2AMEN1MAPTKDM4EGAA
SCHEMBL990381 0.94 KMT2A (0.42) KMT2AMEN1MAPTKDM4EGAA
SCHEMBL992275 0.91 KDM4E (0.53) KMT2AMEN1MAPTKDM4EGAA
SCHEMBL990955 0.91 TUBB1 (0.49) KMT2AMEN1MAPTKDM4EGAA
SCHEMBL990956 0.91 TUBB1 (0.49) KMT2AMEN1MAPTKDM4EGAA

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 13 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-1687678-B1 CHEMICALLY AMPLIFIED POSITIVE PHOTOSENSITIVE THERMOSETTING RESIN COMPOSITION, METHOD OF FORMING CURED ARTICLE AND USE OF THE METHOD FOR PRODUCING FUNCTIONAL DEVICE TOKYO OHKA KOGYO CO LTD (JP) 2013-07-31 EP disclosed
US-7871756-B2 Chemically amplified positive photosensitive thermosetting resin composition, method of forming cured article, and method of producing functional device TOKYO OHKA KOGYO CO., LTD. (JP) 2011-01-18 US disclosed
US-7816072-B2 Positive resist composition and method for forming resist pattern TOKYO OHKA KOGYO CO., LTD. (JP) 2010-10-19 US disclosed
US-20090081590-A1 NEGATIVE RESIST COMPOSITION AND PROCESS FOR FORMING RESIST PATTERNS TOKYO OHKA KOGYO CO., LTD. (JP) 2009-03-26 US disclosed
US-20090068594-A1 POSITIVE RESIST COMPOSITION AND METHOD FOR FORMING RESIST PATTERN TOKYO OHKA KOGYO CO., LTD. (JP) 2009-03-12 US disclosed
US-7358028-B2 Chemically amplified positive photo resist composition and method for forming resist pattern TOKYO OHKA KOGYO CO., LTD. (JP) 2008-04-15 US disclosed
US-20080044764-A1 Chemically Amplified Positive Photosensitive Thermosetting Resin Composition, Method Of Forming Cured Article, And Method Of Producing Functional Device TOKYO OHKA KOGYO CO., LTD. (JP) 2008-02-21 US disclosed
US-7329478-B2 Chemical amplified positive photo resist composition and method for forming resist pattern TOKYO OHKA KOGYO CO., LTD. (JP) 2008-02-12 US disclosed
US-20070117045-A1 CHEMICAL AMPLIFICATION TYPE POSITIVE PHOTORESIST COMPOSITION AND RESIST PATTERN FORMING METHOD TOKYO OHKA KOGYO CO., LTD. (JP) 2007-05-24 US disclosed
US-7105265-B2 Method for removing resist pattern TOKYO OHKA KOGYO CO., LTD. (JP) 2006-09-12 US disclosed
US-20060003260-A1 Chemical amplified positive photo resist composition and method for forming resist pattern TOKYO OHKA KOGYO CO., LTD. (JP) 2006-01-05 US disclosed
US-20050244740-A1 Chemically amplified positive photo resist composition and method for forming resist pattern TOKYO OHKA KOGYO CO., LTD. (JP) 2005-11-03 US disclosed
US-20050130055-A1 Method and removing resist pattern TOKYO OHKA KOGYO CO., LTD. (JP) 2005-06-16 US disclosed