⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL13318485 | 0.94 | — | — | |
| SCHEMBL18104306 | 0.73 | — | — | |
| SCHEMBL9934624 | 0.72 | — | — | |
| SCHEMBL5868414 | 0.67 | — | — | |
| SCHEMBL17886478 | 0.67 | — | — | |
| SCHEMBL16360074 | 0.60 | LMNA (0.36) | — | |
| Scyllitol SCHEMBL959405 | 0.51 | LMNA (1.00) | — | |
| Scyllitol SCHEMBL12377889 | 0.51 | LMNA (1.00) | — | |
| Scyllitol SCHEMBL4438767 | 0.51 | LMNA (1.00) | — | |
| Scyllitol SCHEMBL4447990 | 0.51 | LMNA (1.00) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 142 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20260090293-A1 | SEMICONDUCTOR STACKS AND PROCESSES THEREOF | LAM RES CORP (US) | 2026-03-26 | — | — | US | disclosed |
| WO-2026044028-A1 | APPARATUSES AND TECHNIQUES FOR THERMAL ETCHING | LAM RESEARCH CORPORATION (US) | 2026-02-26 | — | — | WO | disclosed |
| US-20260026274-A1 | IN SITU DECLOGGING IN PLASMA ETCHING | LAM RES CORP (US) | 2026-01-22 | — | — | US | disclosed |
| WO-2025235908-A1 | PASSIVATION FOR ETCHING OF SEMICONDUCTOR MATERIALS WITH SEAM-LIKE DEFECTS | LAM RESEARCH CORPORATION (US) | 2025-11-13 | — | — | WO | disclosed |
| EP-4591341-A1 | SEMICONDUCTOR STACKS AND PROCESSES THEREOF | LAM Research Corporation (US) | 2025-07-30 | — | — | EP | disclosed |
| US-20250226233-A1 | IN SITU DECLOGGING IN PLASMA ETCHING | LAM RESEARCH CORPORATION | 2025-07-10 | — | — | US | disclosed |
| US-20250183051-A1 | SELECTIVE PRECISION ETCHING OF SEMICONDUCTOR MATERIALS | LAM RESEARCH CORPORATION | 2025-06-05 | — | — | US | disclosed |
| WO-2025076005-A1 | SELECTIVITY IN THERMAL ETCH PROCESSES THROUGH SURFACE PASSIVATION | LAM RESEARCH CORPORATION (US) | 2025-04-10 | — | — | WO | disclosed |
| WO-2025072211-A1 | PRETREATING SUBSTRATE FOR SELECTIVE DEPOSITION | LAM RESEARCH CORPORATION (US) | 2025-04-03 | — | — | WO | disclosed |
| WO-2024233369-A1 | ANISOTROPIC THERMAL ETCHING OF SiO2 | LAM RESEARCH CORPORATION (US) | 2024-11-14 | — | — | WO | disclosed |
| US-20090012101-A1 | Mucarinic Agonists and Methods of Use Thereof | UNIVERSITY OF TOLEDO (US) | 2009-01-08 | — | — | US | disclosed |
| US-20080230705-A1 | Radioimaging | SPECTRUM DYNAMICS LLC (US) | 2008-09-25 | — | — | US | disclosed |
| US-7377122-B2 | Coaxial-flow heat exchanging structure for installation in the earth and introducing turbulence into the flow of the aqueoue-based heat transfer fluid flowing along the outer flow channel while its cross-sectional characteristics produce fluid flows therealong having optimal vortex characteristics that optimize heat transfer with the earth | KELIX HEAT TRANSFER SYSTEMS, LLC (US) | 2008-05-27 | — | — | US | disclosed |
| US-7373785-B2 | Geo-thermal heat exchanging system facilitating the transfer of heat energy using coaxial-flow heat exchanging structures installed in the earth for introducing turbulence into the flow of the aqueous-based heat transfer fluid flowing along the outer flow channel | KELIX HEAT TRANSFER SYSTEMS, LLC (US) | 2008-05-20 | — | — | US | disclosed |
| US-7370488-B2 | Geo-thermal heat exchanging system facilitating the transfer of heat energy using coaxial-flow heat exchanging structures installed in the earth for introducing turbulence into the flow of the aqueous-based heat transfer fluid flowing along the outer flow channel | KELIX HEAT TRANSFER SYSTEMS, LLC (US) | 2008-05-13 | — | — | US | disclosed |
| US-20070287261-A1 | TRENCH ISOLATION STRUCTURES FOR INTEGRATED CIRCUITS | ASM INTERNATIONAL N.V. (NL) | 2007-12-13 | — | — | US | disclosed |
| US-20070029066-A1 | Coaxial-flow heat transfer structures for use in diverse applications | KELIX HEAT TRANSFER SYSTEMS, LLC | 2007-02-08 | — | — | US | disclosed |
| US-20070029067-A1 | Coaxial-flow heat transfer structures for use in diverse applications | Perkowski, Thomas (US) | 2007-02-08 | — | — | US | disclosed |
| US-20070023164-A1 | Coaxial-flow heat transfer structures for use in diverse applications | KELIX HEAT TRANSFER SYSTEMS, LLC | 2007-02-01 | — | — | US | disclosed |
| US-20070017243-A1 | Coaxial-flow heat transfer structures for use in diverse applications | KELIX HEAT TRANSFER SYSTEMS, LLC | 2007-01-25 | — | — | US | disclosed |