Predicted protein targets (top 2)
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL14040612 | 0.87 | ALDH1A1 (0.30) | ALDH1A1CYP2C19 | |
| SCHEMBL16892844 | 0.79 | — | — | |
| SCHEMBL14703278 | 0.76 | — | — | |
| SCHEMBL7142725 | 0.69 | — | — | |
| SCHEMBL7142728 | 0.67 | — | — | |
| SCHEMBL21664885 | 0.64 | — | — | |
| SCHEMBL8766278 | 0.64 | — | — | |
| SCHEMBL20968043 | 0.63 | — | — | |
| SCHEMBL18060371 | 0.63 | POLB (0.30) | — | |
| SCHEMBL23875407 | 0.62 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 23 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-12312569-B2 | Kit for cleaning agent and method for preparing cleaning agent | FUJIFILM CORPORATION (JP) | 2025-05-27 | — | — | US | disclosed |
| US-11385548-B2 | Process liquid and method of processing substrate | TOKYO OHKA KOGYO CO., LTD. (JP) | 2022-07-12 | — | — | US | disclosed |
| US-20210395645-A1 | CLEANING LIQUID | FUJIFILM ELECTRONIC MATERIALS CO., LTD. (JP) | 2021-12-23 | — | — | US | disclosed |
| US-20210317391-A1 | KIT FOR CLEANING AGENT AND METHOD FOR PREPARING CLEANING AGENT | FUJIFILM ELECTRONIC MATERIALS CO., LTD. (JP) | 2021-10-14 | — | — | US | disclosed |
| US-20200241424-A1 | PROCESS LIQUID AND METHOD OF PROCESSING SUBSTRATE | TOKYO OHKA KOGYO CO., LTD. (JP) | 2020-07-30 | — | — | US | disclosed |
| WO-2020137359-A1 | KIT FOR CLEANING AGENT AND METHOD FOR PREPARING CLEANING AGENT | 富士フイルムエレクトロニクスマテリアルズ株式会社 | 2020-07-02 | — | — | WO | disclosed |
| US-9862914-B2 | Cleaning agent for semiconductor substrates and method for processing semiconductor substrate surface | WAKO PURE CHEMICAL INDUSTRIES, LTD. (JP) | 2018-01-09 | — | — | US | disclosed |
| EP-3051577-B1 | CLEANING AGENT FOR SEMICONDUCTOR SUBSTRATES AND METHOD FOR PROCESSING SEMICONDUCTOR SUBSTRATE SURFACE | WAKO PURE CHEM IND LTD (JP) | 2017-10-18 | — | — | EP | disclosed |
| US-20160272924-A1 | CLEANING AGENT FOR SEMICONDUCTOR SUBSTRATES AND METHOD FOR PROCESSING SEMICONDUCTOR SUBSTRATE SURFACE | WAKO PURE CHEMICAL INDUSTRIES, LTD. (JP) | 2016-09-22 | — | — | US | disclosed |
| EP-3051577-A1 | CLEANING AGENT FOR SEMICONDUCTOR SUBSTRATES AND METHOD FOR PROCESSING SEMICONDUCTOR SUBSTRATE SURFACE | Wako Pure Chemical Industries, Ltd. (JP) | 2016-08-03 | — | — | EP | disclosed |
| US-9034810-B2 | Processing agent composition for semiconductor surface and method for processing semiconductor surface using same | WAKO PURE CHEMICAL INDUSTRIES, LTD. (JP) | 2015-05-19 | — | — | US | disclosed |
| US-9006164-B2 | Resist remover composition and method for removing resist using the composition | WAKO PURE CHEMICAL INDUSTRIES, LTD. (JP) | 2015-04-14 | — | — | US | disclosed |
| EP-2474862-B1 | COMPOSITION FOR REMOVING A RESIST ON A SEMICONDUCTOR SUBSTRATE AND METHOD FOR REMOVING RESIST USING THE COMPOSITION | WAKO PURE CHEM IND LTD (JP) | 2015-02-25 | — | — | EP | disclosed |
| EP-2647693-A1 | SUBSTRATE CLEANER FOR COPPER WIRING, AND METHOD FOR CLEANING COPPER WIRING SEMICONDUCTOR SUBSTRATE | Wako Pure Chemical Industries, Ltd. (JP) | 2013-10-09 | — | — | EP | disclosed |
| US-20130261040-A1 | SUBSTRATE CLEANER FOR COPPER WIRING, AND METHOD FOR CLEANING COPPER WIRING SEMICONDUCTOR SUBSTRATE | WAKO PURE CHEMICAL INDUSTRIES, LTD. (JP) | 2013-10-03 | — | — | US | disclosed |
| EP-2474862-A1 | RESIST REMOVER COMPOSITION AND METHOD FOR REMOVING RESIST USING THE COMPOSITION | Wako Pure Chemical Industries, Ltd. (JP) | 2012-07-11 | — | — | EP | disclosed |
| EP-2475000-A1 | PROCESSING AGENT COMPOSITION FOR SEMICONDUCTOR SURFACE AND METHOD FOR PROCESSING SEMICONDUCTOR SURFACE USING SAME | Wako Pure Chemical Industries, Ltd. (JP) | 2012-07-11 | — | — | EP | disclosed |
| US-20120172274-A1 | RESIST REMOVER COMPOSITION AND METHOD FOR REMOVING RESIST USING THE COMPOSITION | WAKO PURE CHEMICAL INDUSTRIES, LTD. (JP) | 2012-07-05 | — | — | US | disclosed |
| US-20120157368-A1 | PROCESSING AGENT COMPOSITION FOR SEMICONDUCTOR SURFACE AND METHOD FOR PROCESSING SEMICONDUCTOR SURFACE USING SAME | WAKO PURE CHEMICAL INDUSTRIES, LTD. (JP) | 2012-06-21 | — | — | US | disclosed |
| US-20070197790-A1 | Method for the functionalization of conjugated or conjugatable derivatives assisted by a tempo-type electrophoric mediator | CENTRE NATIONAL DE LA RECHERCHE SCIENTIFIQUE (FR) | 2007-08-23 | — | — | US | disclosed |