Predicted protein targets (top 5)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | LMNA | P02545 | 3/20 | 0.38 |
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.38 |
| ▸ | TDP1 | Q9NUW8 | 2/20 | 0.35 |
| ▸ | L3MBTL1 | Q9Y468 | 1/20 | 0.33 |
| ▸ | THRB | P10828 | 1/20 | 0.30 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL6680217 | 0.81 | — | — | |
| SCHEMBL3389253 | 0.72 | LMNA (0.40) | LMNAALDH1A1TDP1L3MBTL1THRB | |
| SCHEMBL16845318 | 0.67 | — | — | |
| SCHEMBL1258047 | 0.67 | — | — | |
| SCHEMBL7713165 | 0.67 | TDP1 (0.41) | LMNAALDH1A1TDP1L3MBTL1 | |
| SCHEMBL321887 | 0.67 | TSHR (0.41) | — | |
| Glycerin SCHEMBL28081648 | 0.59 | LMNA (0.64) | LMNAALDH1A1TDP1L3MBTL1THRB | |
| SCHEMBL87714 | 0.59 | — | — | |
| E968 SCHEMBL10427336 | 0.56 | — | — | |
| Ammonia Solution, Strong SCHEMBL20897527 | 0.56 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 14 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| WO-2024095926-A1 | CLEANING LIQUID AND SUBSTRATE CLEANING METHOD | 東京応化工業株式会社 | 2024-05-10 | — | — | WO | disclosed |
| US-20230174892-A1 | DETERGENT COMPOSITION AND CHEMICAL-MECHANICAL POLISHING COMPOSITION | DAICEL CORPORATION (JP) | 2023-06-08 | — | — | US | disclosed |
| US-11385548-B2 | Process liquid and method of processing substrate | TOKYO OHKA KOGYO CO., LTD. (JP) | 2022-07-12 | — | — | US | disclosed |
| US-20200241424-A1 | PROCESS LIQUID AND METHOD OF PROCESSING SUBSTRATE | TOKYO OHKA KOGYO CO., LTD. (JP) | 2020-07-30 | — | — | US | disclosed |
| EP-3228730-A1 | ETCHING AGENT AND REPLENISHING SOLUTION THEREFOR, METHOD FOR ROUGHENING SURFACE OF MAGNESIUM COMPONENT, AND METHOD FOR MANUFACTURING MAGNESIUM-RESIN COMPOSITE | MEC COMPANY LTD. (JP) | 2017-10-11 | — | — | EP | disclosed |
| US-20170268112-A1 | ETCHING AGENT AND REPLENISHING SOLUTION THEREFOR, METHOD FOR ROUGHENING SURFACE OF MAGNESIUM COMPONENT, AND METHOD FOR MANUFACTURING MAGNESIUM-RESIN COMPOSITE | MEC COMPANY LTD. (JP) | 2017-09-21 | — | — | US | disclosed |
| EP-2475000-B1 | PROCESSING AGENT COMPOSITION FOR SEMICONDUCTOR SURFACE AND METHOD FOR PROCESSING SEMICONDUCTOR SURFACE USING SAME | WAKO PURE CHEM IND LTD (JP) | 2015-07-01 | — | — | EP | disclosed |
| US-9034810-B2 | Processing agent composition for semiconductor surface and method for processing semiconductor surface using same | WAKO PURE CHEMICAL INDUSTRIES, LTD. (JP) | 2015-05-19 | — | — | US | disclosed |
| US-9006164-B2 | Resist remover composition and method for removing resist using the composition | WAKO PURE CHEMICAL INDUSTRIES, LTD. (JP) | 2015-04-14 | — | — | US | disclosed |
| EP-2474862-B1 | COMPOSITION FOR REMOVING A RESIST ON A SEMICONDUCTOR SUBSTRATE AND METHOD FOR REMOVING RESIST USING THE COMPOSITION | WAKO PURE CHEM IND LTD (JP) | 2015-02-25 | — | — | EP | disclosed |
| EP-2475000-A1 | PROCESSING AGENT COMPOSITION FOR SEMICONDUCTOR SURFACE AND METHOD FOR PROCESSING SEMICONDUCTOR SURFACE USING SAME | Wako Pure Chemical Industries, Ltd. (JP) | 2012-07-11 | — | — | EP | disclosed |
| EP-2474862-A1 | RESIST REMOVER COMPOSITION AND METHOD FOR REMOVING RESIST USING THE COMPOSITION | Wako Pure Chemical Industries, Ltd. (JP) | 2012-07-11 | — | — | EP | disclosed |
| US-20120172274-A1 | RESIST REMOVER COMPOSITION AND METHOD FOR REMOVING RESIST USING THE COMPOSITION | WAKO PURE CHEMICAL INDUSTRIES, LTD. (JP) | 2012-07-05 | — | — | US | disclosed |
| US-20120157368-A1 | PROCESSING AGENT COMPOSITION FOR SEMICONDUCTOR SURFACE AND METHOD FOR PROCESSING SEMICONDUCTOR SURFACE USING SAME | WAKO PURE CHEMICAL INDUSTRIES, LTD. (JP) | 2012-06-21 | — | — | US | disclosed |