SCHEMBL9930633

SCHEMBL9930633

COc1ccc([P+](c2ccc(OC)cc2)(c2ccc(OC)cc2)c2ccc(OC)cc2)cc1.c1ccc([B-](c2ccccc2)(c2ccccc2)c2ccccc2)cc1

nearest known ligand 0.48

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
CA4 P22748 1/20 0.48
LTA4H P09960 2/20 0.47
ALDH1A1 P00352 4/20 0.43
LMNA P02545 2/20 0.43
NPSR1 Q6W5P4 2/20 0.43
HSD17B10 Q99714 1/20 0.43
TRPA1 O75762 1/20 0.42
CA12 O43570 1/20 0.42
CA1 P00915 1/20 0.42
CA2 P00918 1/20 0.42
CA7 P43166 1/20 0.42
CA9 Q16790 1/20 0.42
CA14 Q9ULX7 1/20 0.42
NPC1 O15118 3/20 0.41
RAB9A P51151 3/20 0.41
CYP1A2 P05177 2/20 0.41
CYP2C19 P33261 2/20 0.41
KDM4E B2RXH2 1/20 0.41
TDP1 Q9NUW8 1/20 0.41
L3MBTL1 Q9Y468 1/20 0.41

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Tetraphenylphosphonium SCHEMBL17271410 0.92 CA4 (0.48) CA4LTA4HALDH1A1LMNANPSR1
SCHEMBL17417856 0.86 CA4 (0.59) CA4LTA4HALDH1A1LMNANPSR1
Iodide SCHEMBL10618292 0.84 CA4 (0.56) CA4LTA4HALDH1A1LMNANPSR1
Hydrochloric Acid SCHEMBL7930513 0.84 CA4 (0.56) CA4LTA4HALDH1A1LMNANPSR1
Bromide SCHEMBL7883438 0.84 CA4 (0.56) CA4LTA4HALDH1A1LMNANPSR1
Tetraphenylphosphonium SCHEMBL15070 0.79 HIF1A (0.38) ALDH1A1HSD17B10MAPTSMN1; SMN2
SCHEMBL8573890 0.79 LTA4H (0.42) CA4LTA4HALDH1A1LMNANPSR1
SCHEMBL4387940 0.78 TSHR (0.42) ALDH1A1LMNANPSR1NPC1RAB9A
SCHEMBL8568244 0.77 LTA4H (0.38) CA4LTA4HALDH1A1LMNANPSR1
SCHEMBL1451503 0.76 CA1 (0.65) CA4LTA4HALDH1A1NPSR1CA12

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 3 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20130127071-A1 EPOXY RESIN COMPOSITION FOR SEMICONDUCTOR ENCAPSULATION AND SEMICONDUCTOR DEVICE USING THE SAME NITTO DENKO CORPORATION (JP) 2013-05-23 US disclosed
EP-2594596-A1 Epoxy resin composition for semiconductor encapsulation and semiconductor device using the same NITTO DENKO CORPORATION (JP) 2013-05-22 EP disclosed
US-20120153512-A1 EPOXY RESIN COMPOSITION FOR SEMICONDUCTOR ENCAPSULATION AND SEMICONDUCTOR DEVICE OBTAINED USING THE SAME NITTO DENKO CORPORATION (JP) 2012-06-21 US disclosed