SCHEMBL9933808

SCHEMBL9933808

CCCCCCCCOCC1(CC)COC1

nearest known ligand 0.46

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 1/20 0.42
TDP1 Q9NUW8 1/20 0.42
HTT P42858 2/20 0.38
MEN1 O00255 1/20 0.38
THRB P10828 1/20 0.38
KMT2A Q03164 1/20 0.38
MAPT P10636 1/20 0.38
CES1 P23141 1/20 0.37
CES2 O00748 2/20 0.36
ASGR1 P07306 2/20 0.35
USP2 O75604 1/20 0.34
PRKD3 O94806 1/20 0.33
PRKCG P05129 1/20 0.33
PRKCB P05771 1/20 0.33
PRKCA P17252 1/20 0.33
PRKCH P24723 1/20 0.33
PRKCI P41743 1/20 0.33
PRKCE Q02156 1/20 0.33
PRKCQ Q04759 1/20 0.33
PRKCZ Q05513 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2623190 1.00 ALDH1A1 (0.42) ALDH1A1TDP1HTTMEN1THRB
SCHEMBL2902859 1.00 ALDH1A1 (0.42) ALDH1A1TDP1HTTMEN1THRB
SCHEMBL3164645 1.00 ALDH1A1 (0.42) ALDH1A1TDP1HTTMEN1THRB
SCHEMBL10071379 1.00 ALDH1A1 (0.42) ALDH1A1TDP1HTTMEN1THRB
SCHEMBL14256280 1.00 ALDH1A1 (0.42) ALDH1A1TDP1HTTMEN1THRB
SCHEMBL14256281 1.00 ALDH1A1 (0.42) ALDH1A1TDP1HTTMEN1THRB
SCHEMBL1130616 1.00 ALDH1A1 (0.42) ALDH1A1TDP1HTTMEN1THRB
SCHEMBL5810223 0.98 ALDH1A1 (0.39) ALDH1A1TDP1HTTMEN1THRB
SCHEMBL30963668 0.95 MEN1 (0.41) ALDH1A1TDP1HTTMEN1THRB
SCHEMBL14655776 0.94 ALDH1A1 (0.33) ALDH1A1TDP1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 92 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-120082236-A Photo-curing epoxy ink and preparation method and application thereof 万华化学集团股份有限公司 2025-06-03 CN claimed
CN-117285706-A Cationic photocurable composition, coating material, article having photocurable coating layer, and ink 常州正洁智造科技有限公司 2023-12-26 CN claimed
CN-120082236-A Photo-curing epoxy ink and preparation method and application thereof 万华化学集团股份有限公司 2025-06-03 CN disclosed
WO-2025079368-A1 THERMALLY LATENT CATIONIC POLYMERIZATION INITIATOR, CURABLE RESIN COMPOSITION, AND METAL BONDED BODY 株式会社日本触媒 2025-04-17 WO disclosed
US-20240224409-A1 ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF FUJIFILM CORPORATION (JP) 2024-07-04 US disclosed
US-11958971-B2 Photocurable composition, method for producing concave-convex structure, method for forming fine concave-convex pattern, and concave-convex structure MITSUI CHEMICALS, INC. (JP) 2024-04-16 US disclosed
CN-110741463-B Method for producing substrate with fine concave-convex pattern, resin composition, and laminate 三井化学株式会社 2024-02-20 CN disclosed
CN-117285706-A Cationic photocurable composition, coating material, article having photocurable coating layer, and ink 常州正洁智造科技有限公司 2023-12-26 CN disclosed
CN-113574086-B Photocurable composition, method for producing uneven structure, method for forming fine uneven pattern, and uneven structure 三井化学株式会社 2023-11-07 CN disclosed
US-11737345-B2 Organic electronic material, ink composition containing same, and organic thin film, organic electronic element, organic electroluminescent element, lighting device, and display device formed therewith RESONAC CORPORATION (JP) 2023-08-22 US disclosed
US-11737345-B2 Organic electronic material, ink composition containing same, and organic thin film, organic electronic element, organic electroluminescent element, lighting device, and display device formed therewith RESONAC CORPORATION (JP) 2023-08-22 US disclosed
EP-1757635-B1 Curable ink comprising modified oxetane compound FUJIFILM CORP (JP) 2008-10-08 EP disclosed
US-20080075883-A1 PROCESS FOR PRODUCING MOLDED PRINTED MATERIAL, AND MOLDED PRINTED MATERIAL FUJIFILM CORPORATION (JP) 2008-03-27 US disclosed
US-20080075883-A1 PROCESS FOR PRODUCING MOLDED PRINTED MATERIAL, AND MOLDED PRINTED MATERIAL FUJIFILM CORPORATION (JP) 2008-03-27 US disclosed
US-20070206054-A1 Curable composition, ink composition, inkjet-recording method, and planographic printing plate FUJIFILM CORPORATION (JP) 2007-09-06 US disclosed
US-20070206054-A1 Curable composition, ink composition, inkjet-recording method, and planographic printing plate FUJIFILM CORPORATION (JP) 2007-09-06 US disclosed
EP-1829684-A1 Curable composition, ink composition, inkjet-recording method, and planographic printing plate FUJIFILM Corporation (JP) 2007-09-05 EP disclosed
US-20070049651-A1 Curable composition, ink composition, inkjet recording method, printed material, method of producing planographic printing plate, planographic printing plate, and oxcetane compound FUJI PHOTO FILM CO., LTD. 2007-03-01 US disclosed
US-20070049651-A1 Curable composition, ink composition, inkjet recording method, printed material, method of producing planographic printing plate, planographic printing plate, and oxcetane compound FUJI PHOTO FILM CO., LTD. 2007-03-01 US disclosed
EP-1757635-A1 Curable modified oxetane compound and ink composition comprising it Fuji Photo Film Co., Ltd. (JP) 2007-02-28 EP disclosed