SCHEMBL9935879

SCHEMBL9935879

CC(C)(F)C(=O)C(F)F

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL11657729 0.78
SCHEMBL3967024 0.75
Fluoride SCHEMBL9935043 0.75
SCHEMBL1787333 0.75 ALDH1A1 (0.36)
SCHEMBL891845 0.73
SCHEMBL2650133 0.73
SCHEMBL26939982 0.73 TSHR (0.40)
SCHEMBL22591349 0.71
SCHEMBL16993775 0.71
SCHEMBL1034110 0.69

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 7 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-103415895-B DIELECTRIC INSULATION MEDIUM ABB 技术有限公司 2016-08-03 CN disclosed
EP-2652752-B1 DIELECTRIC INSULATION MEDIUM ABB TECHNOLOGY AG (CH) 2015-09-30 EP disclosed
US-8822870-B2 Dielectric insulation medium ABB TECHNOLOGY LTD. (CH) 2014-09-02 US disclosed
CN-103415895-A Dielectric insulation medium ABB TECHNOLOGY AG 2013-11-27 CN disclosed
US-20130277334-A1 Dielectric Insulation Medium HITACHI ENERGY LTD (CH) 2013-10-24 US disclosed
EP-2652752-A1 DIELECTRIC INSULATION MEDIUM ABB Technology AG (CH) 2013-10-23 EP disclosed
WO-2012080246-A1 DIELECTRIC INSULATION MEDIUM ABB TECHNOLOGY AG (CH) 2012-06-21 WO disclosed