SCHEMBL9943535

SCHEMBL9943535

C=C[Si](ON=C)(ON=C)ON=C

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1149563 0.65
SCHEMBL7608355 0.62
SCHEMBL11339867 0.57
SCHEMBL22614 0.57
SCHEMBL28910834 0.57
SCHEMBL7941635 0.57
SCHEMBL843289 0.55
Hydrogen Sulfide SCHEMBL3652122 0.55
SCHEMBL438202 0.55
SCHEMBL18575587 0.55

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 5 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-9145486-B2 Filled silicone compositions, preparations and uses thereof DOW CORNING CORPORATION (US) 2015-09-29 US disclosed
US-20140296433-A1 Filled Silicone Compositions, Preparations And Uses Thereof DOW COMING CORPORATION (US) 2014-10-02 US disclosed
EP-2744848-A1 FILLED SILICONE COMPOSITIONS, PREPARATIONS AND USES THEREOF Dow Corning Corporation (US) 2014-06-25 EP disclosed
WO-2013022532-A1 FILLED SILICONE COMPOSITIONS, PREPARATIONS AND USES THEREOF DOW CORNING CORPORATION (US) 2013-02-14 WO disclosed
EP-2465895-A1 Heat curable adhesive, sealant and coating Merz+Benteli AG (CH) 2012-06-20 EP disclosed