SCHEMBL7608355

SCHEMBL7608355

C=NO[Si](ON=C)(ON=C)ON=C

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL9943535 0.62
SCHEMBL1372446 0.53
SCHEMBL18828456 0.50
SCHEMBL11294931 0.50
SCHEMBL6152853 0.50
SCHEMBL14797531 0.43
SCHEMBL768643 0.41
SCHEMBL821396 0.41
SCHEMBL16229961 0.37
SCHEMBL247948 0.37

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 15 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-9145486-B2 Filled silicone compositions, preparations and uses thereof DOW CORNING CORPORATION (US) 2015-09-29 US claimed
US-20140296433-A1 Filled Silicone Compositions, Preparations And Uses Thereof DOW COMING CORPORATION (US) 2014-10-02 US claimed
EP-2744848-A1 FILLED SILICONE COMPOSITIONS, PREPARATIONS AND USES THEREOF Dow Corning Corporation (US) 2014-06-25 EP claimed
WO-2013022532-A1 FILLED SILICONE COMPOSITIONS, PREPARATIONS AND USES THEREOF DOW CORNING CORPORATION (US) 2013-02-14 WO claimed
EP-2756040-B1 FILLED SILICONE COMPOSITION, IN SITU PREPARATION AND USE THEREOF DOW CORNING CHINA HOLDING CO LTD (CN) 2018-06-20 EP disclosed
US-9346945-B2 Filled silicone composition, in situ preparation and use thereof DOW CORNING CORPORATION (US) 2016-05-24 US disclosed
US-9145486-B2 Filled silicone compositions, preparations and uses thereof DOW CORNING CORPORATION (US) 2015-09-29 US disclosed
US-20150051345-A1 Filled Silicone Composition, In Situ Preparation And Use Thereof DOW SILICONES CORPORATION 2015-02-19 US disclosed
US-20140296433-A1 Filled Silicone Compositions, Preparations And Uses Thereof DOW COMING CORPORATION (US) 2014-10-02 US disclosed
EP-2756040-A1 FILLED SILICONE COMPOSITION, IN SITU PREPARATION AND USE THEREOF Dow Corning (China) Holding Co. Ltd. (CN) 2014-07-23 EP disclosed
EP-2744848-A1 FILLED SILICONE COMPOSITIONS, PREPARATIONS AND USES THEREOF Dow Corning Corporation (US) 2014-06-25 EP disclosed
WO-2013037105-A1 FILLED SILICONE COMPOSITION, PREPARATION AND USES THEREOF DOW CORNING (CHINA) HOLDING CO., LTD. (CN) 2013-03-21 WO disclosed
WO-2013037148-A1 FILLED SILICONE COMPOSITION, IN SITU PREPARATION AND USE THEREOF DOW CORNING (CHINA) HOLDING CO., LTD. (CN) 2013-03-21 WO disclosed
WO-2013022532-A1 FILLED SILICONE COMPOSITIONS, PREPARATIONS AND USES THEREOF DOW CORNING CORPORATION (US) 2013-02-14 WO disclosed
JP-2002121386-A MANUFACTURING METHOD OF ONE COMPONENT ROOM TEMPERATURE CURING SILICONE ELASTOMER COMPOSITION DOW CORNING TORAY SILICONE CO LTD 2002-04-23 JP disclosed