SCHEMBL9959052

SCHEMBL9959052

O=C(O)CC(S)CCC(CCC(S)CC(=O)O)(CCC(S)CC(=O)O)C(CO)(CO)CCO

nearest known ligand 0.31

Predicted protein targets (top 1)

geneUniProtsupporting neighboursconfidence
FOLH1 Q04609 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1255080 0.84
SCHEMBL3107444 0.81
SCHEMBL129335 0.74 SLC22A6 (0.30)
SCHEMBL2142953 0.74
SCHEMBL9958764 0.71 SLC22A6 (0.33)
SCHEMBL5489383 0.70 CAMK2A (0.40) FOLH1
SCHEMBL6667904 0.69 SLC22A6 (0.43) FOLH1
SCHEMBL14796467 0.68 RNPEP (0.34) FOLH1
SCHEMBL1852982 0.68 FOLH1 (0.39) FOLH1
SCHEMBL540504 0.68 ALDH1A1 (0.35)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-2226347-B1 EPOXY RESIN CURING AGENT, METHOD FOR PRODUCING THE SAME, AND EPOXY RESIN COMPOSITION SHOWA DENKO KK (JP) 2012-06-27 EP claimed
US-9164196-B2 Photosensitive resin composition for a color filter and uses thereof CHI MEI CORPORATION (TW) 2015-10-20 US disclosed
US-9075305-B2 Photosensitive resin composition for color filters and uses thereof CHI MEI CORPORATION (TW) 2015-07-07 US disclosed
CN-103713469-A Photosensitive resin composition for color filter and use thereof CHI MEI CORP 2014-04-09 CN disclosed