SCHEMBL996298

SCHEMBL996298

CP(=O)([O-])CP(C)(=O)[O-].CP(=O)([O-])CP(C)(=O)[O-].CP(=O)([O-])CP(C)(=O)[O-].[Al+3].[Al+3]

nearest known ligand 0.31

Predicted protein targets (top 1)

geneUniProtsupporting neighboursconfidence
CA2 P00918 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Zinc Ion SCHEMBL997813 0.92 CA2 (0.31) CA2
SCHEMBL344503 0.92 CA2 (0.31) CA2
SCHEMBL995597 0.92 CA2 (0.31) CA2
SCHEMBL191057 0.77 TSHR (0.33) CA2
Methyl Phosphonate SCHEMBL7757487 0.74 CA2 (0.42) CA2
SCHEMBL191367 0.74 CA2 (0.42) CA2
Methyl Phosphonate SCHEMBL8532604 0.70
SCHEMBL190266 0.69 LPAR3 (0.31)
SCHEMBL190154 0.69 TSHR (0.33) CA2
SCHEMBL688210 0.69 CA2 (0.31) CA2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 33 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-12365169-B2 Decorative sheet and decorative plate DAI NIPPON PRINTING CO., LTD. (JP) 2025-07-22 US disclosed
EP-4455218-A1 POLYAMIDE COMPOSITION Kuraray Co., Ltd. (JP) 2024-10-30 EP disclosed
CN-117999317-A Poly (arylene ether) resin composition, method of preparing the same, and molded article manufactured using the same 株式会社LG化学 2024-05-07 CN disclosed
CN-112601776-B Polyamide and polyamide composition 株式会社可乐丽 2024-01-02 CN disclosed
US-11851564-B2 Low-halogen flame retardant polyamide compositions resistant to heat aging ASCEND PERFORMANCE MATERIALS OPERATIONS LLC (US) 2023-12-26 US disclosed
EP-3009478-B1 POLYAMIDE RESIN COMPOSITION AND MOLDED ARTICLE PRODUCED THEREFROM KURARAY CO (JP) 2023-11-22 EP disclosed
WO-2023120460-A1 POLYAMIDE COMPOSITION 株式会社クラレ 2023-06-29 WO disclosed
US-20220184932-A1 DECORATIVE SHEET AND DECORATIVE PLATE DAI NIPPON PRINTING CO., LTD. (JP) 2022-06-16 US disclosed
EP-3950325-A1 DECORATIVE SHEET AND DECORATIVE PLATE Dai Nippon Printing Co., Ltd. (JP) 2022-02-09 EP disclosed
EP-3842471-A1 POLYAMIDE AND POLYAMIDE COMPOSITION Kuraray Co., Ltd. (JP) 2021-06-30 EP disclosed
US-8487024-B2 Polyamide, polyamide composition, and method for producing polyamide ASAHI KASEI CHEMICALS CORPORATION (JP) 2013-07-16 US disclosed
US-8338511-B2 Thermoplastic polyester resin composition MITSUBISHI ENGINEERING-PLASTICS CORPORATION (JP) 2012-12-25 US disclosed
EP-2308927-B1 THERMOPLASTIC POLYESTER RESIN COMPOSITION MITSUBISHI ENG PLASTICS CORP (JP) 2012-06-06 EP disclosed
EP-2314643-B1 THERMOPLASTIC POLYESTER RESIN COMPOSITION MITSUBISHI ENG PLASTICS CORP (JP) 2012-05-16 EP disclosed
US-20110201730-A1 THERMOPLASTIC POLYESTER RESIN COMPOSITION MITSUBISHI ENGINEERING-PLASTICS CORPORATION (JP) 2011-08-18 US disclosed
US-20110184101-A1 THERMOPLASTIC POLYESTER RESIN COMPOSITION MITSUBISHI ENGINEERING-PLASTICS CORPORATION (JP) 2011-07-28 US disclosed
EP-2314643-A1 THERMOPLASTIC POLYESTER RESIN COMPOSITION Mitsubishi Engineering-Plastics Corporation (JP) 2011-04-27 EP disclosed
EP-2308927-A1 THERMOPLASTIC POLYESTER RESIN COMPOSITION Mitsubishi Engineering-Plastics Corporation (JP) 2011-04-13 EP disclosed
US-20110028614-A1 POLYAMIDE, POLYAMIDE COMPOSITION, AND METHOD FOR PRODUCING POLYAMIDE ASAHI KASEI CHEMICALS CORPORATION (JP) 2011-02-03 US disclosed
EP-2270067-A1 POLYAMIDE, POLYAMIDE COMPOSITION AND METHOD FOR PRODUCING POLYAMIDE Asahi Kasei Chemicals Corporation (JP) 2011-01-05 EP disclosed