Predicted protein targets (top 14)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | KMT2A | Q03164 | 2/20 | 0.85 |
| ▸ | CA1 | P00915 | 10/20 | 0.60 |
| ▸ | CA2 | P00918 | 10/20 | 0.60 |
| ▸ | ALDH1A1 | P00352 | 2/20 | 0.60 |
| ▸ | USP2 | O75604 | 1/20 | 0.58 |
| ▸ | CYP3A4 | P08684 | 1/20 | 0.57 |
| ▸ | TSHR | P16473 | 1/20 | 0.57 |
| ▸ | CYP2C19 | P33261 | 1/20 | 0.57 |
| ▸ | NPSR1 | Q6W5P4 | 1/20 | 0.57 |
| ▸ | POLB | P06746 | 1/20 | 0.56 |
| ▸ | CTDSP1 | Q9GZU7 | 1/20 | 0.56 |
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.56 |
| ▸ | LMNA | P02545 | 1/20 | 0.54 |
| ▸ | MAPK10 | P53779 | 1/20 | 0.54 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL20589125 | 1.00 | KMT2A (0.85) | KMT2ACA1CA2ALDH1A1USP2 | |
| SCHEMBL3201443 | 0.86 | KMT2A (0.63) | KMT2ACA1CA2ALDH1A1USP2 | |
| SCHEMBL9851212 | 0.86 | KMT2A (0.63) | KMT2ACA1CA2ALDH1A1USP2 | |
| SCHEMBL15101846 | 0.86 | KMT2A (0.63) | KMT2ACA1CA2ALDH1A1USP2 | |
| SCHEMBL10014710 | 0.85 | USP2 (0.76) | KMT2AALDH1A1USP2CYP3A4TSHR | |
| SCHEMBL20968094 | 0.84 | KMT2A (0.61) | KMT2ACA1CA2ALDH1A1USP2 | |
| SCHEMBL13318217 | 0.84 | ALDH1A1 (0.66) | KMT2ACA1CA2ALDH1A1USP2 | |
| SCHEMBL13133138 | 0.81 | KMT2A (0.76) | KMT2ACA1CA2ALDH1A1USP2 | |
| SCHEMBL15101847 | 0.81 | HTT (0.62) | KMT2AALDH1A1USP2CYP3A4TSHR | |
| SCHEMBL5524587 | 0.80 | ALDH1A1 (0.76) | KMT2ACA1CA2ALDH1A1USP2 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 17 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-9023559-B2 | Positive photosensitive resin composition, photosensitive resin film prepared by using the same, and semiconductor device including the photosensitive resin film | CHEIL INDUSTRIES INC. (KR) | 2015-05-05 | — | — | US | disclosed |
| US-8841064-B2 | Positive photosensitive resin composition, photosensitive resin film prepared by using the same, and semiconductor device including the photosensitive resin film | CHEIL INDUSTRIES INC. (KR) | 2014-09-23 | — | — | US | disclosed |
| US-8815489-B2 | Positive photosensitive resin composition, photosensitive resin film prepared by using the same, and semiconductor device including the photosensitive resin film | CHEIL INDUSTRIES INC. (KR) | 2014-08-26 | — | — | US | disclosed |
| US-8785103-B2 | Photosensitive novolac resin, positive photosensitive resin composition including same, photosensitive resin film prepared by using the same, and semiconductor device including the photosensitive resin film | CHEIL INDUSTRIES INC. (KR) | 2014-07-22 | — | — | US | disclosed |
| US-8765012-B2 | Thermosetting composition and printed circuit board using the same | SAMSUNG ELECTRONICS CO., LTD. (KR) | 2014-07-01 | — | — | US | disclosed |
| US-8765012-B2 | Thermosetting composition and printed circuit board using the same | SAMSUNG ELECTRONICS CO., LTD. (KR) | 2014-07-01 | — | — | US | disclosed |
| US-20130171563-A1 | Photosensitive Novolac Resin, Positive Photosensitive Resin Composition Including Same, Photosensitive Resin Film Prepared by Using the Same, and Semiconductor Device Including the Photosensitive Resin Film | CHEIL INDUSTRIES INC. (KR) | 2013-07-04 | — | — | US | disclosed |
| US-20130137036-A1 | Positive Photosensitive Resin Composition, Photosensitive Resin Film Prepared by Using the Same, and Semiconductor Device Including the Photosensitive Resin Film | CHEIL INDUSTRIES INC. (KR) | 2013-05-30 | — | — | US | disclosed |
| US-8420287-B2 | Positive photosensitive resin composition | CHEIL INDUSTRIES INC. (KR) | 2013-04-16 | — | — | US | disclosed |
| US-20120171610-A1 | Positive Photosensitive Resin Composition, Photosensitive Resin Film Prepared by Using the Same, and Semiconductor Device Including the Photosensitive Resin Film | CHEIL INDUSTRIES INC. (KR) | 2012-07-05 | — | — | US | disclosed |
| US-20120171614-A1 | Positive Photosensitive Resin Composition, Photosensitive Resin Film Prepared by Using the Same, and Semiconductor Device Including the Photosensitive Resin Film | CHEIL INDUSTRIES INC. (KR) | 2012-07-05 | — | — | US | disclosed |
| US-20120156614-A1 | Novel Phenol Compounds and Positive Photosensitive Resin Composition Including the Same | SAMSUNG ELECTRONICS CO., LTD. (KR) | 2012-06-21 | — | — | US | disclosed |
| US-20110235292-A1 | THERMOSETTING COMPOSITION AND PRINTED CIRCUIT BOARD USING THE SAME | SAMSUNG ELECTRONICS CO., LTD. (KR) | 2011-09-29 | — | — | US | disclosed |
| US-20110235292-A1 | THERMOSETTING COMPOSITION AND PRINTED CIRCUIT BOARD USING THE SAME | SAMSUNG ELECTRONICS CO., LTD. (KR) | 2011-09-29 | — | — | US | disclosed |
| US-20110111346-A1 | Positive Photosensitive Resin Composition | CHEIL INDUSTRIES INC. (KR) | 2011-05-12 | — | — | US | disclosed |
| US-20100124037-A1 | THERMOSETTING COMPOSITION AND PRINTED CIRCUIT BOARD USING THE SAME | SAMSUNG ELECTRONICS CO., LTD. (KR) | 2010-05-20 | — | — | US | disclosed |
| US-20100124037-A1 | THERMOSETTING COMPOSITION AND PRINTED CIRCUIT BOARD USING THE SAME | SAMSUNG ELECTRONICS CO., LTD. (KR) | 2010-05-20 | — | — | US | disclosed |
Patent text — is the patent's own abstract consistent with the prediction?
For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.
| Patent | Title | Text reads most about | Predicted target · text-rank |
|---|---|---|---|
| US-20120156614-A1 | Novel Phenol Compounds and Positive Photosensitive Resin Composition Including the Same | SUN2, TYR, PSMD2 | KMT2A 595/4885CA1 4119/4885CA2 2469/4885 |
“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.