SCHEMBL998177

SCHEMBL998177

CC(N)(N)C1(C)CCCCC1

nearest known ligand 0.32

Predicted protein targets (top 2)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 1/20 0.32
TDP1 Q9NUW8 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL24193238 0.82 ALDH1A1 (0.32) ALDH1A1TDP1
SCHEMBL10588001 0.79
SCHEMBL28540737 0.75
SCHEMBL6905022 0.75
SCHEMBL21974453 0.73
SCHEMBL15491823 0.73
SCHEMBL19195142 0.73
SCHEMBL21974222 0.73
SCHEMBL21974456 0.73
SCHEMBL21974221 0.73

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 53 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-3837302-B1 THERMOPLASTIC MOLDING MATERIAL BASF SE (DE) 2025-10-08 EP disclosed
CN-119409941-A Demulsification type aqueous epoxy resin curing agent, preparation method thereof and aqueous coating 万华化学集团股份有限公司 2025-02-11 CN disclosed
US-12215213-B2 Thermoplastic moulding compound BASF SE (DE) 2025-02-04 US disclosed
EP-3601424-B1 FLAME-RETARDANT POLYAMIDE MOULDING MASSES BASF SE (DE) 2024-06-12 EP disclosed
US-11939469-B2 Thermoplastic molding material BASF SE (DE) 2024-03-26 US disclosed
CN-113423784-B Thermoplastic molding compound 巴斯夫欧洲公司 2023-12-22 CN disclosed
EP-3935107-B1 POLYAMIDE MOLDING COMPOSITION FOR HIGH-GLOSS APPLICATIONS BASF SE (DE) 2023-05-10 EP disclosed
EP-3927772-B1 THERMOPLASTIC MOULDING MATERIAL BASF SE (DE) 2023-04-12 EP disclosed
US-20220185994-A1 THERMOPLASTIC MOULDING COMPOUND BASF SE (DE) 2022-06-16 US disclosed
EP-3775013-B1 FLAME-RETARDANT THERMOPLASTIC MOLDING COMPOSITION BASF SE (DE) 2022-06-15 EP disclosed
CN-103087472-A Liquid resin composition for electronic component and electronic component device HITACHI CHEMICAL CO LTD 2013-05-08 CN disclosed
CN-101851388-B Liquid resin composition for electronic component and electronic component device HITACHI CHEMICAL CO LTD 2013-02-13 CN disclosed
CN-102516748-A Flowable polyamides comprising hyperbranched polyesters/polycarbonates BASF AG 2012-06-27 CN disclosed
US-7875361-B2 Constructing a light source molding of a polyamide copolymer based on isophthalic acid, 1,12-dodecanedicarboxylic acid, bis/4-aminocyclohexyl/methanae and a dimethyl p-diaminocyclohexylmethane having heat resistance (200 degrees C.) and dimensional stability; coating with a metal; light soures; lamps EMS-CHEMIE AG (CH) 2011-01-25 US disclosed
CN-101851388-A Liquid resin composition for electronic component and electronic component device HITACHI CHEMICAL CO LTD 2010-10-06 CN disclosed
EP-1805262-B1 FLOWABLE POLYAMIDES COMPRISING HYPERBRANCHED POLYESTERS/POLYCARBONATES BASF SE (DE) 2008-04-09 EP disclosed
US-20080015303-A1 Flowable Polyamides With Hyperbranched Polyesters/Polycarbonates BASF AKTIENGESELLSCHAFT (DE) 2008-01-17 US disclosed
CN-101084270-A Flowable polyamides comprising hyperbranched polyesters/polycarbonates BASF AG (DE) 2007-12-05 CN disclosed
EP-1805262-A1 FLOWABLE POLYAMIDES COMPRISING HYPERBRANCHED POLYESTERS/POLYCARBONATES BASF AKTIENGESELLSCHAFT (DE) 2007-07-11 EP disclosed
WO-2006042705-A1 FLOWABLE POLYAMIDES COMPRISING HYPERBRANCHED POLYESTERS/POLYCARBONATES BASF AKTIENGESELLSCHAFT (DE) 2006-04-27 WO disclosed