SCHEMBL998768

SCHEMBL998768

O=[C]c1ccc2c(c1)C=CC(=O)C2

nearest known ligand 0.36

Predicted protein targets (top 3)

geneUniProtsupporting neighboursconfidence
GSK3A P49840 1/20 0.36
GSK3B P49841 1/20 0.36
TRPA1 O75762 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL28642002 0.73 CMA1 (0.43) GSK3AGSK3BTRPA1
SCHEMBL8086692 0.73 TYR (0.41) GSK3AGSK3B
SCHEMBL2497578 0.73 CA1 (0.33)
SCHEMBL6230840 0.71 GSK3A (0.50) GSK3AGSK3B
SCHEMBL9574412 0.70 KDM4E (0.39) GSK3AGSK3B
SCHEMBL3128521 0.69 ALDH1A1 (0.50)
SCHEMBL1143146 0.69 METAP1 (0.47)
SCHEMBL28510714 0.69 GSK3A (0.48) GSK3AGSK3B
SCHEMBL5479958 0.69 GSK3A (0.48) GSK3AGSK3B
SCHEMBL31222675 0.68 CA1 (0.44) GSK3AGSK3B

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 19 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-4673724-A FROM P-OXYBENZOYL AND 2-OXY-6-NAPHTHOYL COMPOUND TOYO BOSEKI KABUSHIKI KAISHA (JP) 1987-06-16 US claimed
JP-61285217-A None JP disclosed
JP-61276819-A None JP disclosed
US-7875807-B2 Elastic conductive resin, and electronic device including elastic conductive bumps made of the elastic conductive resin RICOH COMPANY, LTD. (JP) 2011-01-25 US disclosed
CN-100541770-C Elastic conduction resin and electronic installation RICOH KK (JP) 2009-09-16 CN disclosed
US-20070132098-A1 ELASTIC CONDUCTIVE RESIN, AND ELECTRONIC DEVICE INCLUDING ELASTIC CONDUCTIVE BUMPS MADE OF THE ELASTIC CONDUCTIVE RESIN SANO TAKESHI 2007-06-14 US disclosed
US-20040108133-A1 Elastic conductive resin, and electronic device including elastic conductive bumps made of the elastic conductive resin RICOH COMPANY, LTD. (JP) 2004-06-10 US disclosed
CN-1477704-A Elastic electroconductive resin and electronic device ������������ʽ���� 2004-02-25 CN disclosed
EP-1027995-B1 High-durability ink containment unit for use in an ink delivery system HEWLETT PACKARD CO (US) 2002-09-25 EP disclosed
US-6241349-B1 High-durability ink containment unit for use in an ink delivery system HEWLETT-PACKARD COMPANY 2001-06-05 US disclosed
US-6210816-B1 Translucent xerographic recording substrates XEROX CORPORATION 2001-04-03 US disclosed
US-6196669-B1 High durability pressure control bladder for use in an ink delivery system HEWLETT-PACKARD COMPANY 2001-03-06 US disclosed
US-6177500-B1 CONTAINING A P-OXYBENZOYL UNIT (A) AND A 4'-OXYBIPHENYL-4-CARBONYL UNIT (B) AND 1 TO 400 PARTS BY WEIGHT OF AN INORGANIC FILLER. SUMITOMO CEMICAL COMPANY, LIMITED (JP) 2001-01-23 US disclosed
EP-1027995-A1 High-durability ink containment unit for use in an ink delivery system Hewlett-Packard Company (US) 2000-08-16 EP disclosed
EP-0557434-B1 POLYESTERS FROM TEREPHTHALIC ACID, 2,6-NAPHTHALENEDICARBOXYLIC ACID, HYDROQUINONE AND 4,4'-BIPHENOL EASTMAN CHEM CO (US) 1998-05-13 EP disclosed
US-4673724-A FROM P-OXYBENZOYL AND 2-OXY-6-NAPHTHOYL COMPOUND TOYO BOSEKI KABUSHIKI KAISHA (JP) 1987-06-16 US disclosed
US-4673724-A FROM P-OXYBENZOYL AND 2-OXY-6-NAPHTHOYL COMPOUND TOYO BOSEKI KABUSHIKI KAISHA (JP) 1987-06-16 US disclosed
JP-S61285217-A COMPOSITE MATERIAL TOYOBO CO LTD 1986-12-16 JP disclosed
JP-S61276819-A POLYMER WHISKER TOYOBO CO LTD 1986-12-06 JP disclosed