SCHEMBL10001987

SCHEMBL10001987

Cc1ccc(Oc2ccc(C)cc2C(F)(F)F)cc1

nearest known ligand 0.51

Predicted protein targets (top 11)

geneUniProtsupporting neighboursconfidence
AR P10275 9/20 0.51
HTR2A P28223 2/20 0.50
SLC6A4 P31645 2/20 0.50
KCNH2 Q12809 2/20 0.50
SYK P43405 1/20 0.49
MAPT P10636 1/20 0.43
MAPK1 P28482 1/20 0.43
RAB9A P51151 1/20 0.41
L3MBTL1 Q9Y468 1/20 0.41
PLA2G7 Q13093 1/20 0.40
TEAD4 Q15561 1/20 0.39

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL10001973 0.98 AR (0.51) ARHTR2ASLC6A4KCNH2SYK
SCHEMBL13308509 0.93 AR (0.48) ARHTR2ASLC6A4KCNH2SYK
SCHEMBL14586632 0.91 SLC6A4 (0.54) ARHTR2ASLC6A4KCNH2SYK
SCHEMBL14549515 0.91 AR (0.47) ARHTR2ASLC6A4KCNH2SYK
SCHEMBL12259242 0.91 AR (0.47) ARHTR2ASLC6A4KCNH2SYK
SCHEMBL23894307 0.90 LTA4H (0.47) ARHTR2ASLC6A4KCNH2SYK
SCHEMBL8737035 0.89 SYK (0.47) ARHTR2ASLC6A4KCNH2SYK
SCHEMBL26037439 0.89 TEAD4 (0.46) ARHTR2ASLC6A4KCNH2SYK
SCHEMBL10001984 0.88 SYK (0.54) ARHTR2ASLC6A4KCNH2SYK
SCHEMBL4054640 0.88 SLC6A4 (0.61) ARHTR2ASLC6A4KCNH2MAPT

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 45 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-11319410-B2 Precursor for polyimide and use thereof ETERNAL MATERIALS CO., LTD. (TW) 2022-05-03 US disclosed
US-11034797-B2 Polyimide precursor composition, use thereof and polyimide made therefrom ETERNAL MATERIALS CO., LTD. (TW) 2021-06-15 US disclosed
US-20210079161-A1 POLYIMIDE PRECURSOR COMPOSITION, USE THEREOF AND POLYIMIDE MADE THEREFROM ETERNAL MATERIALS CO., LTD. (TW) 2021-03-18 US disclosed
US-10731004-B2 Polyimide precursor composition and use thereof ETERNAL MATERIALS CO., LTD. (TW) 2020-08-04 US disclosed
US-10696793-B2 Process for preparing polyimides ETERNAL MATERIALS CO., LTD. (TW) 2020-06-30 US disclosed
US-10626220-B2 Precursor for polyimide and use thereof ETERNAL MATERIALS CO., LTD. (TW) 2020-04-21 US disclosed
US-20200055986-A1 PROCESS FOR PREPARING POLYIMIDES ETERNAL MATERIALS CO., LTD. (TW) 2020-02-20 US disclosed
US-10280334-B2 Polyimides, coating composition formed therefrom and use thereof ETERNAL MATERIALS CO., LTD. (TW) 2019-05-07 US disclosed
US-20180194899-A1 PRECURSOR FOR POLYIMIDE AND USE THEREOF ETERNAL MATERIALS CO., LTD. (TW) 2018-07-12 US disclosed
US-20180194899-A1 PRECURSOR FOR POLYIMIDE AND USE THEREOF ETERNAL MATERIALS CO., LTD. (TW) 2018-07-12 US disclosed
US-20110212402-A1 PHOTOSENSITIVE RESIN COMPOSITION AND ITS APPLICATION ETERNAL CHEMICAL CO., LTD. (TW) 2011-09-01 US disclosed
US-20110212402-A1 PHOTOSENSITIVE RESIN COMPOSITION AND ITS APPLICATION ETERNAL CHEMICAL CO., LTD. (TW) 2011-09-01 US disclosed
US-20100086874-A1 Photosensitive polymides ETERNAL CHEMICAL CO., LTD. (TW) 2010-04-08 US disclosed
US-20100086871-A1 PHOTOSENSITIVE POLYIMIDES ETERNAL CHEMICAL CO., LTD. 2010-04-08 US disclosed
US-20100086871-A1 PHOTOSENSITIVE POLYIMIDES ETERNAL CHEMICAL CO., LTD. 2010-04-08 US disclosed
US-20100086874-A1 Photosensitive polymides ETERNAL CHEMICAL CO., LTD. (TW) 2010-04-08 US disclosed
US-20090181324-A1 PHOTOSENSITIVE POLYIMIDES ETERNAL CHEMICAL CO., LTD. 2009-07-16 US disclosed
US-20090181324-A1 PHOTOSENSITIVE POLYIMIDES ETERNAL CHEMICAL CO., LTD. 2009-07-16 US disclosed
US-7183278-B1 Picolinamide derivative and harmful organism control agent comprising said picolinamide derivative as active component MEIJI SEIKA KAISHA, LTD. (JP) 2007-02-27 US disclosed
US-7183278-B1 Picolinamide derivative and harmful organism control agent comprising said picolinamide derivative as active component MEIJI SEIKA KAISHA, LTD. (JP) 2007-02-27 US disclosed