SCHEMBL10010751

SCHEMBL10010751

C=COC1CCCCC1CC

nearest known ligand 0.33

Predicted protein targets (top 5)

geneUniProtsupporting neighboursconfidence
CHRNB2 P17787 2/20 0.33
CHRNA7 P36544 2/20 0.33
CHRNA4 P43681 2/20 0.33
CHRNB4 P30926 1/20 0.33
CHRNA3 P32297 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL18768245 0.80 CA1 (0.39)
SCHEMBL6603678 0.79 ADH1C (0.31)
SCHEMBL13686304 0.77
SCHEMBL21628350 0.75 CA1 (0.34)
SCHEMBL27117987 0.73 KDM4E (0.45)
SCHEMBL21227367 0.73 KDM4E (0.45)
SCHEMBL16229734 0.73 KDM4E (0.45)
SCHEMBL25741004 0.73 KDM4E (0.45)
SCHEMBL1437814 0.73 KDM4E (0.45)
SCHEMBL8441042 0.72 MEN1 (0.35)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 12 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20170108775-A1 RESIST COMPOSITION AND PATTERNING PROCESS SHIN-ETSU CHEMICAL CO., LTD. (JP) 2017-04-20 US disclosed
CN-102585166-B Active resin composition, method of surface mounting and printed substrate YAMAHIDE CHEMISTRY CO., LTD. (JP) 2016-06-01 CN disclosed
US-9072205-B1 Surface mounting method utilizing active resin composition SAN-EI KAGAKU CO., LTD. (JP) 2015-06-30 US disclosed
US-20150158103-A1 SURFACE MOUNTING METHOD UTILIZING ACTIVE RESIN COMPOSITION SAN-EI KAGAKU CO., LTD. (JP) 2015-06-11 US disclosed
CN-102585166-A Active resin composition, surface mounting method and printed wiring board SAN EI KAGAKU CO 2012-07-18 CN disclosed
US-20120168219-A1 ACTIVE RESIN COMPOSITION, SURFACE MOUNTING METHOD AND PRINTED WIRING BOARD SAN-EI KAGAKU CO., LTD (JP) 2012-07-05 US disclosed
CN-100432129-C Thermal stabilizer compositions for halogen-containing vinyl polymers ROHM & HAAS (US) 2008-11-12 CN disclosed
CN-100363399-C Photocurable composition and method for producing the same, photocurable pressure-sensitive adhesive sheet and method for producing the same, and method for bonding SEKISUI CHEMICAL CO LTD (JP) 2008-01-23 CN disclosed
CN-1286908-C Photocureable composition photocureable pressure sensitive adhesive sheet and adhering method thereof SEKISUI CHEMICAL CO LTD (JP) 2006-11-29 CN disclosed
CN-1727383-A Thermal stabilizer compositions for halogen-containing vinyl polymers ROHM & HAAS (US) 2006-02-01 CN disclosed
CN-1576340-A Photocureable composition photocureable pressure sensitive adhesive sheet and adhering method thereof SEKISUI CHEMICAL CO LTD (JP) 2005-02-09 CN disclosed
CN-1434834-A Photocurable composition and method for producing the same, photocurable pressure-sensitive adhesive sheet and method for producing the same, and method for bonding SEKISUI CHEMICAL CO LTD (JP) 2003-08-06 CN disclosed