⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL15915907 | 0.97 | — | — | |
| SCHEMBL1314591 | 0.81 | — | — | |
| SCHEMBL19952890 | 0.79 | — | — | |
| SCHEMBL19953084 | 0.78 | — | — | |
| SCHEMBL19953167 | 0.76 | — | — | |
| SCHEMBL1315001 | 0.76 | — | — | |
| SCHEMBL1314660 | 0.76 | — | — | |
| SCHEMBL93991 | 0.75 | — | — | |
| SCHEMBL1314107 | 0.73 | — | — | |
| SCHEMBL1313978 | 0.72 | NFE2L2 (0.33) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 17 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-9970103-B2 | Film deposition material, sealing film using the same and use thereof | TOSOH CORPORATION (JP) | 2018-05-15 | — | — | US | disclosed |
| US-9695301-B2 | Nanoparticle, method for producing nanoparticle, addition curing silicone resin composition, and semiconductor apparatus | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2017-07-04 | — | — | US | disclosed |
| US-9695301-B2 | Nanoparticle, method for producing nanoparticle, addition curing silicone resin composition, and semiconductor apparatus | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2017-07-04 | — | — | US | disclosed |
| US-20160355671-A1 | NANOPARTICLE, METHOD FOR PRODUCING NANOPARTICLE, ADDITION CURING SILICONE RESIN COMPOSITION, AND SEMICONDUCTOR APPARATUS | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2016-12-08 | — | — | US | disclosed |
| US-20160355671-A1 | NANOPARTICLE, METHOD FOR PRODUCING NANOPARTICLE, ADDITION CURING SILICONE RESIN COMPOSITION, AND SEMICONDUCTOR APPARATUS | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2016-12-08 | — | — | US | disclosed |
| US-20160326642-A1 | FILM DEPOSITION MATERIAL, SEALING FILM USING THE SAME AND USE THEREOF | TOSOH CORPORATION (JP) | 2016-11-10 | — | — | US | disclosed |
| US-20160185912-A1 | CURABLE SILICONE RESIN COMPOSITION | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2016-06-30 | — | — | US | disclosed |
| US-20160185912-A1 | CURABLE SILICONE RESIN COMPOSITION | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2016-06-30 | — | — | US | disclosed |
| US-20140219903-A1 | FILM DEPOSITION MATERIAL, SEALING FILM USING THE SAME AND USE THEREOF | TOSOH CORPORATION (JP) | 2014-08-07 | — | — | US | disclosed |
| US-8791213-B2 | Curable silicone resin composition | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2014-07-29 | — | — | US | disclosed |
| US-8791213-B2 | Curable silicone resin composition | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2014-07-29 | — | — | US | disclosed |
| US-20140024796-A1 | CURABLE SILICONE RESIN COMPOSITION | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2014-01-23 | — | — | US | disclosed |
| US-20140024796-A1 | CURABLE SILICONE RESIN COMPOSITION | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2014-01-23 | — | — | US | disclosed |
| US-8168730-B2 | Curable silicone rubber composition and cured product thereof | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2012-05-01 | — | — | US | disclosed |
| US-7989574-B2 | Curable silicone rubber composition and cured product thereof | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2011-08-02 | — | — | US | disclosed |
| US-20080015326-A1 | CURABLE SILICONE RUBBER COMPOSITION AND CURED PRODUCT THEREOF | SHIN -ETSU CHEMICAL CO., LTD. (JP) | 2008-01-17 | — | — | US | disclosed |
| US-20070166470-A1 | CURABLE SILICONE RUBBER COMPOSITION AND CURED PRODUCT THEREOF | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2007-07-19 | — | — | US | disclosed |