SCHEMBL93991

SCHEMBL93991

C=C[Si](C=C)(O[Si](C=C)(C=C)C1CCCCC1)C1CCCCC1

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL15915045 0.97
SCHEMBL1314831 0.81
SCHEMBL15015216 0.78
SCHEMBL1317887 0.76
SCHEMBL1314004 0.76
SCHEMBL10014693 0.75
SCHEMBL1314684 0.73
SCHEMBL1315629 0.72 NFE2L2 (0.33)
SCHEMBL15915907 0.72
SCHEMBL94010 0.71

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 57 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-9970103-B2 Film deposition material, sealing film using the same and use thereof TOSOH CORPORATION (JP) 2018-05-15 US disclosed
US-9695301-B2 Nanoparticle, method for producing nanoparticle, addition curing silicone resin composition, and semiconductor apparatus SHIN-ETSU CHEMICAL CO., LTD. (JP) 2017-07-04 US disclosed
US-9695301-B2 Nanoparticle, method for producing nanoparticle, addition curing silicone resin composition, and semiconductor apparatus SHIN-ETSU CHEMICAL CO., LTD. (JP) 2017-07-04 US disclosed
US-9657175-B2 Silicone resin composition for sealing optical semiconductor element and optical semiconductor device SHIN-ETSU CHEMICAL CO., LTD. (JP) 2017-05-23 US disclosed
US-9657175-B2 Silicone resin composition for sealing optical semiconductor element and optical semiconductor device SHIN-ETSU CHEMICAL CO., LTD. (JP) 2017-05-23 US disclosed
US-20160355671-A1 NANOPARTICLE, METHOD FOR PRODUCING NANOPARTICLE, ADDITION CURING SILICONE RESIN COMPOSITION, AND SEMICONDUCTOR APPARATUS SHIN-ETSU CHEMICAL CO., LTD. (JP) 2016-12-08 US disclosed
US-20160355671-A1 NANOPARTICLE, METHOD FOR PRODUCING NANOPARTICLE, ADDITION CURING SILICONE RESIN COMPOSITION, AND SEMICONDUCTOR APPARATUS SHIN-ETSU CHEMICAL CO., LTD. (JP) 2016-12-08 US disclosed
US-20160326642-A1 FILM DEPOSITION MATERIAL, SEALING FILM USING THE SAME AND USE THEREOF TOSOH CORPORATION (JP) 2016-11-10 US disclosed
US-9403967-B2 Curable resin composition, cured product thereof and photosemiconductor apparatus SHIN-ETSU CHEMICAL CO., LTD. (JP) 2016-08-02 US disclosed
US-9403967-B2 Curable resin composition, cured product thereof and photosemiconductor apparatus SHIN-ETSU CHEMICAL CO., LTD. (JP) 2016-08-02 US disclosed
US-20110269918-A1 HIGH ADHESIVENESS SILICONE RESIN COMPOSITION AND AN OPTICAL SEMICONDUCTOR DEVICE PROVIDED WITH A CURED PRODUCT THEREOF SHIN-ETSU CHEMICAL CO., LTD. (JP) 2011-11-03 US disclosed
US-7989574-B2 Curable silicone rubber composition and cured product thereof SHIN-ETSU CHEMICAL CO., LTD. (JP) 2011-08-02 US disclosed
US-20110147955-A1 SILICONE RESIN COMPOSITION AND A CURED PRODUCT THEREOF SHIN-ETSU CHEMICAL CO., LTD. (JP) 2011-06-23 US disclosed
US-20110147955-A1 SILICONE RESIN COMPOSITION AND A CURED PRODUCT THEREOF SHIN-ETSU CHEMICAL CO., LTD. (JP) 2011-06-23 US disclosed
US-20090236759-A1 CURABLE SILICONE RUBBER COMPOSITION AND SEMICONDUCTOR DEVICE SHIN-ETSU CHEMICAL CO., LTD. (JP) 2009-09-24 US disclosed
US-7588967-B2 Curable silicone rubber composition and semiconductor device SHIN-ETSU CHEMICAL CO., LTD. (JP) 2009-09-15 US disclosed
US-7521813-B2 Protective coating is cured unsaturated polysiloxane rubber SHIN-ESTU CHEMICAL CO., LTD. (JP) 2009-04-21 US disclosed
US-20080015326-A1 CURABLE SILICONE RUBBER COMPOSITION AND CURED PRODUCT THEREOF SHIN -ETSU CHEMICAL CO., LTD. (JP) 2008-01-17 US disclosed
US-20070166470-A1 CURABLE SILICONE RUBBER COMPOSITION AND CURED PRODUCT THEREOF SHIN-ETSU CHEMICAL CO., LTD. (JP) 2007-07-19 US disclosed
US-20070077360-A1 Method of reducing surface tackiness of silicone rubber cured product, liquid silicone rubber composition for sealing semiconductor, silicone rubber-sealed semiconductor device, and method of producing semiconductor device SHIN -ETSU CHEMICAL CO., LTD. (JP) 2007-04-05 US disclosed