Predicted protein targets (top 14)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | HTR2C | P28335 | 6/20 | 0.41 |
| ▸ | SLC18A3 | Q16572 | 1/20 | 0.39 |
| ▸ | SIGMAR1 | Q99720 | 1/20 | 0.39 |
| ▸ | CYP2D6 | P10635 | 1/20 | 0.35 |
| ▸ | DRD2 | P14416 | 1/20 | 0.35 |
| ▸ | DRD3 | P35462 | 1/20 | 0.35 |
| ▸ | CHRNB2 | P17787 | 1/20 | 0.34 |
| ▸ | CHRNA4 | P43681 | 1/20 | 0.34 |
| ▸ | MEN1 | O00255 | 2/20 | 0.33 |
| ▸ | KMT2A | Q03164 | 2/20 | 0.33 |
| ▸ | NPC1 | O15118 | 1/20 | 0.33 |
| ▸ | HPN | P05981 | 1/20 | 0.33 |
| ▸ | POLB | P06746 | 1/20 | 0.33 |
| ▸ | PRCP | P42785 | 1/20 | 0.33 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL27660071 | 0.84 | CYP3A4 (0.44) | CHRNB2CHRNA4 | |
| SCHEMBL27594648 | 0.84 | DRD2 (0.49) | HTR2CDRD2DRD3 | |
| SCHEMBL28038489 | 0.84 | HTR2A (0.43) | HTR2CNPC1 | |
| Hydrochloric Acid SCHEMBL27749956 | 0.83 | DDB1 (0.42) | HTR2CPOLB | |
| SCHEMBL1435756 | 0.81 | SLC18A3 (0.46) | SLC18A3SIGMAR1CYP2D6MEN1KMT2A | |
| Hydrochloric Acid SCHEMBL11019819 | 0.79 | GAA (0.45) | SLC18A3SIGMAR1MEN1KMT2ANPC1 | |
| SCHEMBL16884717 | 0.78 | CYP2D6 (0.35) | SLC18A3SIGMAR1CYP2D6MEN1KMT2A | |
| SCHEMBL1001194 | 0.77 | MAPT (0.33) | CHRNB2CHRNA4 | |
| SCHEMBL27888409 | 0.77 | ALDH1A1 (0.57) | MEN1KMT2A | |
| SCHEMBL3745191 | 0.72 | SLC18A3 (0.43) | SLC18A3SIGMAR1CHRNB2CHRNA4MEN1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 61 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-4246394-A | PROMOTER FOR CROSSLINKING | VEBA-CHEMIE AKTIENGESELLSCHAFT (DE) | 1981-01-20 | — | — | US | claimed |
| US-4176142-A | Powder coating composition | WESTERN ELECTRIC COMPANY, INC. (US) | 1979-11-27 | — | — | US | claimed |
| WO-2025069598-A1 | EPOXY RESIN CURING AGENT, EPOXY RESIN COMPOSITION, SEALING MATERIAL, CONDUCTIVE MATERIAL, THERMALLY CONDUCTIVE MATERIAL, ADHESIVE FOR CAMERA MODULES, ADHESIVE FOR STRUCTURES, MATRIX RESIN FOR FIBER-REINFORCED PLASTICS, IMPREGNATED FIXING MATERIAL, INTERLAYER INSULATING FILM, FILM-TYPE SOLDER RESIST, SEALING SHEET, CONDUCTIVE FILM, ANISOTROPIC CONDUCTIVE FILM, THERMALLY CONDUCTIVE FILM, AND METHOD FOR PRODUCING DYED CURED PRODUCT | 旭化成株式会社 | 2025-04-03 | — | — | WO | disclosed |
| US-20240376291-A1 | EPOXY RESIN COMPOSITION, FILM, METHOD FOR PRODUCING FILM, AND CURED PRODUCTS | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2024-11-14 | — | — | US | disclosed |
| US-20240240067-A1 | THERMALLY CONDUCTIVE ADHESIVE COMPOSITION, PREPARATION METHOD AND USE THEREOF | HENKEL AG & CO KGAA (DE) | 2024-07-18 | — | — | US | disclosed |
| CN-117980427-A | Thermally conductive adhesive composition, method for the production and use thereof | 汉高股份有限及两合公司 | 2024-05-03 | — | — | CN | disclosed |
| CN-117580888-A | Epoxy resin composition, film, method for producing film, and cured product | 旭化成株式会社 | 2024-02-20 | — | — | CN | disclosed |
| WO-2023286499-A1 | EPOXY RESIN COMPOSITION, FILM, FILM PRODUCTION METHOD, AND CURED PRODUCT | 旭化成株式会社 | 2023-01-19 | — | — | WO | disclosed |
| CN-112724596-A | Curable composition and cured product | 盛势达技研株式会社 | 2021-04-30 | — | — | CN | disclosed |
| EP-3118236-B1 | RESIN COMPOSITION AND CURED PRODUCT THEREOF | OMRON TATEISI ELECTRONICS CO (JP) | 2020-07-01 | — | — | EP | disclosed |
| US-10427394-B2 | Method for curing resin composition | OMRON CORPORATION (JP) | 2019-10-01 | — | — | US | disclosed |
| US-5567782-A | ELASTIC ADHESIVE | HOECHST AKTIENGESELLSCHAFT (DE) | 1996-10-22 | — | — | US | disclosed |
| EP-0703258-A2 | Curable, powdery mixtures | HOECHST AKTIENGESELLSCHAFT (DE) | 1996-03-27 | — | — | EP | disclosed |
| US-5459208-A | Elasticity at low temperatures; automobile structural adhesive | HOECHST AKTIENGESELLSCHAFT (DE) | 1995-10-17 | — | — | US | disclosed |
| EP-0675143-A2 | Amine-modified epoxy resin composition | HOECHST AKTIENGESELLSCHAFT (DE) | 1995-10-04 | — | — | EP | disclosed |
| EP-0675185-A2 | Elastic amine-modified epoxy resin composition | HOECHST AKTIENGESELLSCHAFT (DE) | 1995-10-04 | — | — | EP | disclosed |
| EP-0658583-A2 | Epoxy resin-hardener system having elastic properties | HOECHST AKTIENGESELLSCHAFT (DE) | 1995-06-21 | — | — | EP | disclosed |
| EP-0658584-A2 | Epoxy resin-hardener system having elastic properties | HOECHST AKTIENGESELLSCHAFT (DE) | 1995-06-21 | — | — | EP | disclosed |
| EP-0617069-A2 | Curable, powdery mixtures | HOECHST AKTIENGESELLSCHAFT (DE) | 1994-09-28 | — | — | EP | disclosed |
| US-4176142-A | Powder coating composition | WESTERN ELECTRIC COMPANY, INC. (US) | 1979-11-27 | — | — | US | disclosed |