SCHEMBL10033495

SCHEMBL10033495

CCC(C)C(=O)OCCC#N

nearest known ligand 0.39

Predicted protein targets (top 6)

geneUniProtsupporting neighboursconfidence
MEN1 O00255 1/20 0.39
KMT2A Q03164 1/20 0.39
TSHR P16473 3/20 0.34
DPP4 P27487 1/20 0.31
ALDH1A1 P00352 1/20 0.31
CASP1 P29466 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL10176903 1.00 MEN1 (0.39) MEN1KMT2ATSHRDPP4ALDH1A1
SCHEMBL12430278 0.90 TSHR (0.38) MEN1KMT2ATSHRDPP4ALDH1A1
SCHEMBL19881228 0.87 NAAA (0.36) MEN1KMT2ATSHR
SCHEMBL10010649 0.84 TSHR (0.35) MEN1KMT2ATSHRDPP4
SCHEMBL10011415 0.84 TSHR (0.40) MEN1KMT2ATSHRDPP4
SCHEMBL11892829 0.82 MEN1 (0.34) MEN1KMT2ATSHRDPP4
SCHEMBL10011009 0.82 MEN1 (0.34) MEN1KMT2ATSHRDPP4
SCHEMBL19117208 0.82 MEN1 (0.40) MEN1KMT2ATSHRDPP4ALDH1A1
SCHEMBL19116973 0.81 MEN1 (0.38) MEN1KMT2ATSHRDPP4ALDH1A1
SCHEMBL12390085 0.81 MEN1 (0.38) MEN1KMT2ATSHRDPP4ALDH1A1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 26 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-3476904-B1 SURFACE TREATMENT LIQUID AND SURFACE TREATMENT METHOD TOKYO OHKA KOGYO CO LTD (JP) 2023-01-18 EP disclosed
EP-3553147-B1 SURFACE TREATMENT LIQUID AND SURFACE TREATMENT METHOD TOKYO OHKA KOGYO CO LTD (JP) 2022-05-11 EP disclosed
EP-3147334-B1 SURFACE TREATMENT LIQUID TOKYO OHKA KOGYO CO LTD (JP) 2021-03-31 EP disclosed
EP-3604467-A1 SURFACE TREATMENT LIQUID AND SURFACE TREATMENT METHOD Tokyo Ohka Kogyo Co., Ltd. (JP) 2020-02-05 EP disclosed
EP-2236647-B1 PROCESS FOR ADSORBING PLATING CATALYSTS, PROCESS FOR PRODUCTION OF SUBSTRATES PROVIDED WITH METAL LAYERS AND PLATING CATALYST CONTAINING FLUID FOR USE IN BOTH PROCESSES FUJIFILM CORP (JP) 2018-02-21 EP disclosed
US-20170266694-A1 SURFACE TREATMENT METHOD, ANTI-STATIC AGENT, AND HYDROPHILIZING TREATMENT AGENT TOKYO OHKA KOGYO CO., LTD. (JP) 2017-09-21 US disclosed
US-20170088683-A1 SURFACE TREATMENT LIQUID TOKYO OHKA KOGYO CO., LTD. (JP) 2017-03-30 US disclosed
EP-3147334-A1 SURFACE TREATMENT LIQUID TOKYO OHKA KOGYO CO., LTD. (JP) 2017-03-29 EP disclosed
US-20170067165-A1 CONDUCTIVE LAMINATE FOR TOUCH PANEL, TOUCH PANEL, AND TRANSPARENT CONDUCTIVE LAMINATE FUJIFILM CORPORATION (JP) 2017-03-09 US disclosed
US-20140342174-A1 MIRROR FILM, METHOD FOR PRODUCING THE SAME, AND MIRROR FILM FOR SOLAR THERMAL POWER GENERATORS OR SOLAR PHOTOVOLTAIC POWER GENERATORS FUJIFILM CORPORATION (JP) 2014-11-20 US disclosed
US-20110104454-A1 COMPOSITION FOR FORMING LAYER TO BE PLATED, METHOD OF PRODUCING METAL PATTERN MATERIAL, AND METAL PATTERN MATERIAL FUJIFILM CORPORATION (JP) 2011-05-05 US disclosed
US-20100323174-A1 METHODS FOR PREPARING METAL FILM-CARRYING SUBSTRATES, METAL FILM-CARRYING SUBSTRATES, METHODS FOR PREPARING METAL PATTERN MATERIALS, AND METAL PATTERN MATERIALS FUJIFILM CORPORATION (JP) 2010-12-23 US disclosed
US-20100279012-A1 METHOD FOR ADSORBING PLATING CATALYST, METHOD FOR PREPARING SUBSTRATE PROVIDED WITH METAL LAYER, AND PLATING CATALYST SOLUTION USED IN THE SAME FUJIFILM CORPORATION (JP) 2010-11-04 US disclosed
US-20100247880-A1 NOVEL COPOLYMER, NOVEL COPOLYMER-CONTAINING COMPOSITION, LAMINATE BODY, METHOD OF PRODUCING METAL FILM-COATED MATERIAL, METAL FILM-COATED MATERIAL, METHOD OF PRODUCING METALLIC PATTERN-BEARING MATERIAL AND METALLIC PATTERN-BEARING MATERIAL FUJIFILM CORPORATION (JP) 2010-09-30 US disclosed
US-20100243461-A1 METHOD OF FABRICATING CIRCUIT BOARD FUJIFILM CORPORATION (JP) 2010-09-30 US disclosed
US-20100080893-A1 METHOD OF FORMING METAL FILM FUJIFILM CORPORATION (JP) 2010-04-01 US disclosed
US-20100080964-A1 COMPOSITION FOR FORMING LAYER TO BE PLATED, METHOD OF PRODUCING METAL PATTERN MATERIAL, METAL PATTERN MATERIAL FUJIFILM CORPORATION (JP) 2010-04-01 US disclosed
US-20090269599-A1 MULTILAYER FILM FOR PLATING, METHOD OF MANUFACTURING METAL FILM-COATED MATERIAL AND METAL FILM-COATED MATERIAL FUJIFILM CORPORATION (JP) 2009-10-29 US disclosed
US-20090266583-A1 PHOTOSENSITIVE RESIN COMPOSITION, LAMINATE, METHOD OF PRODUCING METAL PLATED MATERIAL, METAL PLATED MATERIAL, METHOD OF PRODUCING METAL PATTERN MATERIAL, METAL PATTERN MATERIAL AND WIRING SUBSTRATE FUJIFILM CORPORATION (JP) 2009-10-29 US disclosed
US-20090155553-A1 Method of manufacturing surface metal film material, surface metal film material, method of manufacturing patterned metal material, patterned metal material, and polymer layer-forming composition FUJIFILM CORPORATION (JP) 2009-06-18 US disclosed