SCHEMBL12430278

SCHEMBL12430278

CCC(C)C(=O)OCCCC#N

nearest known ligand 0.39

Predicted protein targets (top 12)

geneUniProtsupporting neighboursconfidence
TSHR P16473 2/20 0.38
MEN1 O00255 1/20 0.38
KMT2A Q03164 1/20 0.38
ALDH1A1 P00352 1/20 0.33
ATM Q13315 1/20 0.31
CHRM2 P08172 1/20 0.31
CHRM4 P08173 1/20 0.31
CHRM1 P11229 1/20 0.31
CHRM3 P20309 1/20 0.31
ACHE P22303 1/20 0.31
NAAA Q02083 1/20 0.31
DPP4 P27487 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL19881228 0.93 NAAA (0.36) TSHRMEN1KMT2AACHENAAA
SCHEMBL10033495 0.90 MEN1 (0.39) TSHRMEN1KMT2AALDH1A1DPP4
SCHEMBL10176903 0.90 MEN1 (0.39) TSHRMEN1KMT2AALDH1A1DPP4
SCHEMBL10011875 0.85 TSHR (0.34) TSHRMEN1KMT2ADPP4
SCHEMBL10012313 0.85 TSHR (0.39) TSHRMEN1KMT2ADPP4
SCHEMBL10012054 0.85 TSHR (0.34) TSHRMEN1KMT2ADPP4
SCHEMBL19116949 0.82 TSHR (0.39) TSHRMEN1KMT2AALDH1A1ATM
SCHEMBL19117261 0.82 MEN1 (0.37) TSHRMEN1KMT2AALDH1A1ATM
SCHEMBL19116960 0.81 MEN1 (0.36) TSHRMEN1KMT2AALDH1A1CHRM2
SCHEMBL13541256 0.79 ALDH1A1 (0.54) TSHRALDH1A1ATMACHENAAA

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 5 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8293846-B2 Composition for forming layer to be plated, method of producing metal pattern material, metal pattern material FUJIFILM CORPORATION (JP) 2012-10-23 US disclosed
US-7977029-B2 Positive photosensitive composition FUJIFILM CORPORATION (JP) 2011-07-12 US disclosed
US-20110104454-A1 COMPOSITION FOR FORMING LAYER TO BE PLATED, METHOD OF PRODUCING METAL PATTERN MATERIAL, AND METAL PATTERN MATERIAL FUJIFILM CORPORATION (JP) 2011-05-05 US disclosed
US-20100080964-A1 COMPOSITION FOR FORMING LAYER TO BE PLATED, METHOD OF PRODUCING METAL PATTERN MATERIAL, METAL PATTERN MATERIAL FUJIFILM CORPORATION (JP) 2010-04-01 US disclosed
US-20080318159-A1 POSITIVE PHOTOSENSITIVE COMPOSITION FUJIFILM CORPORATION (JP) 2008-12-25 US disclosed