SCHEMBL10033558

SCHEMBL10033558

CCC(C)(CO)C(=O)OCCC#N

nearest known ligand 0.42

Predicted protein targets (top 4)

geneUniProtsupporting neighboursconfidence
MEN1 O00255 1/20 0.42
KMT2A Q03164 1/20 0.42
PRKCA P17252 1/20 0.32
ALDH1A1 P00352 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL21561605 0.81 MEN1 (0.43) MEN1KMT2A
SCHEMBL10033538 0.80 MEN1 (0.46) MEN1KMT2AALDH1A1
SCHEMBL2754865 0.80 PRKCA (0.36) KMT2APRKCAALDH1A1
SCHEMBL2754861 0.80 GRM1 (0.36) PRKCAALDH1A1
SCHEMBL20528155 0.78 MEN1 (0.56) MEN1KMT2AALDH1A1
SCHEMBL8247883 0.77 MEN1 (0.46) MEN1KMT2APRKCA
SCHEMBL13829122 0.77 CYP4F2 (0.41) PRKCAALDH1A1
SCHEMBL862911 0.77 ALDH1A1 (0.47) ALDH1A1
SCHEMBL28586646 0.76 MEN1 (0.44) MEN1KMT2APRKCA
SCHEMBL24961548 0.76 MEN1 (0.46) MEN1KMT2A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 5 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8202576-B2 Method of forming metal film FUJIFILM CORPORATION (JP) 2012-06-19 US disclosed
US-20120009385-A1 RESIN COMPLEX AND LAMINATE FUJIFILM CORPORATION (JP) 2012-01-12 US disclosed
US-20100080893-A1 METHOD OF FORMING METAL FILM FUJIFILM CORPORATION (JP) 2010-04-01 US disclosed
US-20090266583-A1 PHOTOSENSITIVE RESIN COMPOSITION, LAMINATE, METHOD OF PRODUCING METAL PLATED MATERIAL, METAL PLATED MATERIAL, METHOD OF PRODUCING METAL PATTERN MATERIAL, METAL PATTERN MATERIAL AND WIRING SUBSTRATE FUJIFILM CORPORATION (JP) 2009-10-29 US disclosed
US-20090155553-A1 Method of manufacturing surface metal film material, surface metal film material, method of manufacturing patterned metal material, patterned metal material, and polymer layer-forming composition FUJIFILM CORPORATION (JP) 2009-06-18 US disclosed