SCHEMBL10033565

SCHEMBL10033565

C=CC(=O)OCCNC(=O)OCCOCCOC(=O)C(C)CC

nearest known ligand 0.50

Predicted protein targets (top 15)

geneUniProtsupporting neighboursconfidence
TSHR P16473 7/20 0.50
ALDH1A1 P00352 3/20 0.50
TP53 P04637 2/20 0.50
HIF1A Q16665 2/20 0.50
HSD17B10 Q99714 1/20 0.50
THRB P10828 1/20 0.43
ACHE P22303 8/20 0.40
HPGD P15428 1/20 0.40
CHRNB2 P17787 1/20 0.36
CHRNB4 P30926 1/20 0.36
CHRNA3 P32297 1/20 0.36
CHRNA4 P43681 1/20 0.36
CYP3A4 P08684 1/20 0.36
MEN1 O00255 1/20 0.36
KMT2A Q03164 1/20 0.36

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL25784316 0.97 TSHR (0.50) TSHRALDH1A1TP53HIF1AHSD17B10
SCHEMBL10033496 0.96 ACHE (0.42) TSHRALDH1A1TP53HIF1AHSD17B10
SCHEMBL11920493 0.91 TSHR (0.47) TSHRALDH1A1ACHEHPGDCYP3A4
SCHEMBL25784333 0.91 TSHR (0.47) TSHRALDH1A1ACHEHPGDCYP3A4
SCHEMBL12677528 0.90 TSHR (0.45) TSHRALDH1A1TP53HIF1AHSD17B10
SCHEMBL25784317 0.88 ACHE (0.47) TSHRALDH1A1TP53HIF1AHSD17B10
SCHEMBL22667483 0.88 TSHR (0.54) TSHRALDH1A1TP53HIF1AHSD17B10
SCHEMBL25501326 0.87 TSHR (0.66) TSHRALDH1A1TP53HIF1AHSD17B10
SCHEMBL13872044 0.86 TSHR (0.68) TSHRALDH1A1TP53HIF1AHSD17B10
SCHEMBL21148424 0.86 TSHR (0.68) TSHRALDH1A1TP53HIF1AHSD17B10

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 12 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8202576-B2 Method of forming metal film FUJIFILM CORPORATION (JP) 2012-06-19 US disclosed
US-20120009385-A1 RESIN COMPLEX AND LAMINATE FUJIFILM CORPORATION (JP) 2012-01-12 US disclosed
US-20100279012-A1 METHOD FOR ADSORBING PLATING CATALYST, METHOD FOR PREPARING SUBSTRATE PROVIDED WITH METAL LAYER, AND PLATING CATALYST SOLUTION USED IN THE SAME FUJIFILM CORPORATION (JP) 2010-11-04 US disclosed
US-20100273014-A1 METAL-CLAD SUBSTRATE, AND METHOD FOR PRODUCTION THEREOF FUJIFILM CORPORATION (JP) 2010-10-28 US disclosed
US-20100272902-A1 PLATING METHOD, METHOD FOR FORMING METAL THIN FILM, AND PLATING CATALYST LIQUID FUJIFILM CORPORATION (JP) 2010-10-28 US disclosed
US-20100243461-A1 METHOD OF FABRICATING CIRCUIT BOARD FUJIFILM CORPORATION (JP) 2010-09-30 US disclosed
US-20100080893-A1 METHOD OF FORMING METAL FILM FUJIFILM CORPORATION (JP) 2010-04-01 US disclosed
US-20100003533-A1 METAL-FILM-COATED MATERIAL AND PROCESS FOR PRODUCING THE SAME, METALLIC-PATTERN-BEARING MATERIAL AND PROCESS FOR PRODUCING THE SAME, COMPOSITION FOR POLYMER LAYER FORMATION, NITRILE GROUP-CONTAINING POLYMER AND METHOD OF SYNTHESIZING THE SAME, COMPOSITION CONTAINING NITRILE GROUP-CONTAINING POLYMER, AND LAMINATE FUJIFILM CORPORATION (JP) 2010-01-07 US disclosed
US-20090269599-A1 MULTILAYER FILM FOR PLATING, METHOD OF MANUFACTURING METAL FILM-COATED MATERIAL AND METAL FILM-COATED MATERIAL FUJIFILM CORPORATION (JP) 2009-10-29 US disclosed
US-20090266583-A1 PHOTOSENSITIVE RESIN COMPOSITION, LAMINATE, METHOD OF PRODUCING METAL PLATED MATERIAL, METAL PLATED MATERIAL, METHOD OF PRODUCING METAL PATTERN MATERIAL, METAL PATTERN MATERIAL AND WIRING SUBSTRATE FUJIFILM CORPORATION (JP) 2009-10-29 US disclosed
US-20090214876-A1 METAL-FILM-COATED MATERIAL AND PROCESS FOR PRODUCING THE SAME, METALLIC-PATTERN-BEARING MATERIAL AND PROCESS FOR PRODUCING THE SAME, COMPOSITION FOR POLYMER LAYER FORMATION, NITRILE GROUP-CONTAINING POLYMER AND METHOD OF SYNTHESIZING THE SAME, COMPOSITION CONTAINING NITRILE GROUP-CONTAINING POLYMER, AND LAMINATE FUJIFILM CORPORATION (JP) 2009-08-27 US disclosed
US-20090155553-A1 Method of manufacturing surface metal film material, surface metal film material, method of manufacturing patterned metal material, patterned metal material, and polymer layer-forming composition FUJIFILM CORPORATION (JP) 2009-06-18 US disclosed