Tetrahydrofuran

Tetrahydrofuran

SCHEMBL1004236

C1CCOC1.CCC(CO)(CO)CO

nearest known ligand 0.40

Full drug profile on Sugi Atlas →

Predicted protein targets (top 1)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 1/20 0.40

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL360869 0.90 TSHR (0.33) ALDH1A1
Oxirane SCHEMBL4369627 0.87 ALDH1A1 (0.32) ALDH1A1
Oxirane SCHEMBL37156 0.87 ALDH1A1 (0.32) ALDH1A1
Oxirane SCHEMBL10390543 0.87 ALDH1A1 (0.32) ALDH1A1
Oxirane SCHEMBL1717599 0.87 ALDH1A1 (0.32) ALDH1A1
Oxirane SCHEMBL1204102 0.87 ALDH1A1 (0.32) ALDH1A1
Tetrahydrofuran SCHEMBL9062179 0.84 ALDH1A1 (0.50) ALDH1A1
Tetrahydrofuran SCHEMBL28473962 0.83 LMNA (0.34) ALDH1A1
Bicarbonate SCHEMBL25347895 0.81
Cyclohexane SCHEMBL25412687 0.81 ALDH1A1 (0.35) ALDH1A1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 67 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-112236460-B Free radical polymerizable putty-like resin composition, sealant, and crack repair method 株式会社力森诺科 2023-09-22 CN disclosed
CN-113045714-B Low odor resin composition 株式会社力森诺科 2023-09-15 CN disclosed
CN-115851037-A Cationic light-cured LED-UV ink and preparation method thereof 珠海传美讯新材料股份有限公司 2023-03-28 CN disclosed
CN-109071777-B Composition for carbon fiber-reinforced resin, carbon fiber-reinforced resin composition, and cured product 昭和电工株式会社 2022-06-10 CN disclosed
US-20220049039-A1 RADICAL POLYMERIZABLE RESIN COMPOSITION AND STRUCTURE REPAIRING MATERIAL SHOWA DENKO K.K. (JP) 2022-02-17 US disclosed
US-20210283655-A1 STRUCTURE REPAIRING METHOD SHOWA DENKO K.K. (JP) 2021-09-16 US disclosed
EP-3858805-A1 STRUCTURE REPAIRING METHOD Showa Denko K.K. (JP) 2021-08-04 EP disclosed
EP-3858880-A1 RADICAL POLYMERIZABLE RESIN COMPOSITION AND STRUCTURE REPAIRING MATERIAL Showa Denko K.K. (JP) 2021-08-04 EP disclosed
US-20210214471-A1 RADICALLY POLYMERIZABLE PUTTY-LIKE RESIN COMPOSITION, SEALING AGENT AND CRACK REPAIRING METHOD SHOWA DENKO K.K. (JP) 2021-07-15 US disclosed
CN-113045714-A Low odor resin composition 昭和电工株式会社 2021-06-29 CN disclosed
US-20140113115-A1 TRANSFER FILM FOR IN-MOLD MOLDING AND METHOD FOR PRODUCING SAME JNC CORPORATION (JP) 2014-04-24 US disclosed
CN-103635316-A Weather-resistant layered film JNC CORP 2014-03-12 CN disclosed
CN-103608160-A Transfer film for in-mold molding and method for manufacturing same JNC CORP 2014-02-26 CN disclosed
US-20130258482-A1 LAMINATE BODY AND MANUFACTURING METHOD THEREOF JNC CORPORATION (JP) 2013-10-03 US disclosed
EP-2631068-A1 LAMINATE BODY AND MANUFACTURING METHOD THEREOF JNC Corporation (JP) 2013-08-28 EP disclosed
CN-103153617-A Laminate body and manufacturing method thereof JNC CORP 2013-06-12 CN disclosed
US-20110189470-A1 CURABLE RESIN COMPOSITION AND OPTICAL FILM CHISSO CORPORATION (JP) 2011-08-04 US disclosed
US-7868112-B2 Fluorine-containing polymer and resin composition CHISSO CORPORATION (JP) 2011-01-11 US disclosed
US-20100063222-A1 FLUORINE-CONTAINING POLYMER AND RESIN COMPOSITION CHISSO CORPORATION (JP) 2010-03-11 US disclosed
EP-2103636-A1 FLUORINE-CONTAINING POLYMER AND RESIN COMPOSITION Chisso Corporation (JP) 2009-09-23 EP disclosed