SCHEMBL10043076

SCHEMBL10043076

O=C1C=CC(=O)N1c1ccc(Cc2ccc(N3C(=O)CCC3=O)cc2)cc1

nearest known ligand 0.78

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
MGLL Q99685 13/20 0.78
FAAH O00519 6/20 0.78
HSP90AA1 P07900 2/20 0.47
TDP1 Q9NUW8 2/20 0.47
PKM P14618 1/20 0.47
MAPK1 P28482 1/20 0.47
NPSR1 Q6W5P4 1/20 0.47
LMNA P02545 2/20 0.46
CA12 O43570 2/20 0.46
CA1 P00915 2/20 0.46
CA9 Q16790 2/20 0.46
ALDH1A1 P00352 1/20 0.46
CCR6 P51684 1/20 0.46
CACNA1B Q00975 1/20 0.46
APBA1 Q02410 1/20 0.46
APOBEC3G Q9HC16 1/20 0.46
POLB P06746 1/20 0.46
CA2 P00918 1/20 0.44
HPGD P15428 1/20 0.44
KMT2A Q03164 1/20 0.44

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL23220502 0.91 MGLL (0.64) MGLLFAAHHSP90AA1PKMLMNA
SCHEMBL15317853 0.90 FAAH (0.59) MGLLFAAHPKMNPSR1LMNA
SCHEMBL25883485 0.88 MGLL (0.71) MGLLFAAHHSP90AA1TDP1PKM
SCHEMBL114168 0.88 MGLL (1.00) MGLLFAAHHSP90AA1TDP1PKM
SCHEMBL30508999 0.88 MGLL (0.60) MGLLFAAHHSP90AA1PKMALDH1A1
SCHEMBL18844320 0.85 KMT2A (0.60) MGLLFAAHPKMMAPK1NPSR1
SCHEMBL21215695 0.82 MGLL (0.88) MGLLFAAHHSP90AA1TDP1PKM
SCHEMBL10581467 0.82 MGLL (0.88) MGLLFAAHHSP90AA1TDP1PKM
SCHEMBL2900691 0.81 MGLL (0.84) MGLLFAAHHSP90AA1TDP1PKM
SCHEMBL19074450 0.80 CA12 (0.51) MGLLFAAHLMNACA12CA1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 8 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-3187251-B1 POLYMER AND METHOD FOR PREPARING THE SAME IND TECH RES INST (TW) 2020-09-09 EP disclosed
WO-2020017412-A1 RESIN COMPOSITION, PREPREG, METAL FOIL-CLAD LAMINATED PLATE, RESIN SHEET, AND PRINTED-WIRING BOARD 三菱瓦斯化学株式会社 2020-01-23 WO disclosed
EP-2070987-B1 TWO-PART THERMOCURABLE POLYIMIDE RESIN COMPOSITION AND CURED PRODUCT THEREOF MITSUBISHI GAS CHEMICAL CO (JP) 2012-12-12 EP disclosed
EP-2009058-B1 THERMOSETTING POLYIMIDE RESIN COMPOSITION AND CURED PRODUCT THEREOF MITSUBISHI GAS CHEMICAL CO (JP) 2012-07-18 EP disclosed
US-8217099-B2 Thermosetting resin composition ITEQ (DONGGUAN) CORPORATION (CN) 2012-07-10 US disclosed
US-8104148-B2 Kind of prepolymer and its product-thermosetting resins composite ITEQ (DONGGUAN) CORPORATION (CN) 2012-01-31 US disclosed
US-20090292062-A1 THERMOSETTING RESIN COMPOSITION ITEQ (DONGGUAN) CORPORATION (CN) 2009-11-26 US disclosed
US-20090292050-A1 Kind of Prepolymer and Its Product-Thermosetting Resins Composite ITEQ CORPORATION (TW) 2009-11-26 US disclosed