SCHEMBL10049673

SCHEMBL10049673

CCCCCCCCCCCCCC[Si](C)(C)O[Si](C)(C)O[Si](C)(C)CC[Si](OC)(OC)OC

nearest known ligand 0.44

Predicted protein targets (top 2)

geneUniProtsupporting neighboursconfidence
LMNA P02545 1/20 0.44
FAAH O00519 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL10049672 1.00 LMNA (0.44) LMNAFAAH
SCHEMBL10049678 1.00 LMNA (0.44) LMNAFAAH
SCHEMBL10049676 1.00 LMNA (0.44) LMNAFAAH
SCHEMBL10049681 0.92 LMNA (0.47) LMNAFAAH
SCHEMBL652309 0.92 LMNA (0.47) LMNAFAAH
SCHEMBL5172783 0.92 LMNA (0.47) LMNAFAAH
SCHEMBL10049677 0.92 LMNA (0.47) LMNAFAAH
SCHEMBL19239610 0.86 TSHR (0.40) LMNA
SCHEMBL21382197 0.85 LMNA (0.35) LMNAFAAH
SCHEMBL12573376 0.84 LMNA (0.41) LMNA

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8119758-B2 Curable polysiloxane combined with organosilicon wetting agent having triorganooxysilyl and long chain alkylene endgroups, filler and curing agent; flexibility, stable viscosity, easy handling, moldability; cured product as grease between electronic component and heat sink SHIN-ETSU CHEMICAL CO., LTD. (JP) 2012-02-21 US disclosed
US-20080057325-A1 HEAT-CONDUCTIVE SILICONE COMPOSITION AND CURED PRODUCT THEREOF SHIN-ETSU CHEMICAL CO., LTD. (JP) 2008-03-06 US disclosed
US-20070293624-A1 HEAT CONDUCTIVE SILICONE GREASE COMPOSITION SHIN-ETSU CHEMICAL CO., LTD. (JP) 2007-12-20 US disclosed
US-20070290202-A1 ORGANOSILICON COMPOUND SHIN-ETSU CHEMICAL CO., LTD. (JP) 2007-12-20 US disclosed