Predicted protein targets (top 5)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | LMNA | P02545 | 1/20 | 0.47 |
| ▸ | FAAH | O00519 | 1/20 | 0.34 |
| ▸ | TSHR | P16473 | 1/20 | 0.32 |
| ▸ | THRB | P10828 | 1/20 | 0.32 |
| ▸ | EPHX1 | P07099 | 1/20 | 0.31 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL10049681 | 1.00 | LMNA (0.47) | LMNAFAAHTSHRTHRBEPHX1 | |
| SCHEMBL5172783 | 1.00 | LMNA (0.47) | LMNAFAAHTSHRTHRBEPHX1 | |
| SCHEMBL10049677 | 1.00 | LMNA (0.47) | LMNAFAAHTSHRTHRBEPHX1 | |
| SCHEMBL10049676 | 0.92 | LMNA (0.44) | LMNAFAAH | |
| SCHEMBL10049673 | 0.92 | LMNA (0.44) | LMNAFAAH | |
| SCHEMBL10049678 | 0.92 | LMNA (0.44) | LMNAFAAH | |
| SCHEMBL10049672 | 0.92 | LMNA (0.44) | LMNAFAAH | |
| SCHEMBL12573376 | 0.92 | LMNA (0.41) | LMNA | |
| SCHEMBL16191413 | 0.85 | LMNA (0.41) | LMNA | |
| SCHEMBL30134506 | 0.85 | LMNA (0.41) | LMNA |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 8 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-8119652-B2 | Aryl-fused spirocyclic compounds | MERCK SHARP & DOHME CORP. (US) | 2012-02-21 | — | — | US | claimed |
| US-8119758-B2 | Curable polysiloxane combined with organosilicon wetting agent having triorganooxysilyl and long chain alkylene endgroups, filler and curing agent; flexibility, stable viscosity, easy handling, moldability; cured product as grease between electronic component and heat sink | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2012-02-21 | — | — | US | disclosed |
| US-8119758-B2 | Curable polysiloxane combined with organosilicon wetting agent having triorganooxysilyl and long chain alkylene endgroups, filler and curing agent; flexibility, stable viscosity, easy handling, moldability; cured product as grease between electronic component and heat sink | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2012-02-21 | — | — | US | disclosed |
| US-20080057325-A1 | HEAT-CONDUCTIVE SILICONE COMPOSITION AND CURED PRODUCT THEREOF | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2008-03-06 | — | — | US | disclosed |
| US-20080057325-A1 | HEAT-CONDUCTIVE SILICONE COMPOSITION AND CURED PRODUCT THEREOF | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2008-03-06 | — | — | US | disclosed |
| US-20070293624-A1 | HEAT CONDUCTIVE SILICONE GREASE COMPOSITION | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2007-12-20 | — | — | US | disclosed |
| US-20070293624-A1 | HEAT CONDUCTIVE SILICONE GREASE COMPOSITION | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2007-12-20 | — | — | US | disclosed |
| US-20070290202-A1 | ORGANOSILICON COMPOUND | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2007-12-20 | — | — | US | disclosed |