SCHEMBL1006495

SCHEMBL1006495

CCC(CCCOCC1CO1)[Si](OC)(OC)OC

nearest known ligand 0.53

Predicted protein targets (top 6)

geneUniProtsupporting neighboursconfidence
SMN1; SMN2 Q16637 1/20 0.53
ALDH1A1 P00352 4/20 0.50
TSHR P16473 2/20 0.50
TDP1 Q9NUW8 1/20 0.50
MAPK1 P28482 1/20 0.35
PDK1 Q15118 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL27836060 0.90 SMN1; SMN2 (0.56) SMN1; SMN2ALDH1A1TSHRTDP1MAPK1
SCHEMBL133208 0.88 ALDH1A1 (0.59) SMN1; SMN2ALDH1A1TSHRTDP1MAPK1
SCHEMBL28904552 0.87 ALDH1A1 (0.62) SMN1; SMN2ALDH1A1TSHRTDP1MAPK1
SCHEMBL1005637 0.87 SMN1; SMN2 (0.51) SMN1; SMN2ALDH1A1TSHRTDP1MAPK1
SCHEMBL29077312 0.87 TSHR (0.49) SMN1; SMN2ALDH1A1TSHRTDP1MAPK1
SCHEMBL27902491 0.82 TSHR (0.44) SMN1; SMN2ALDH1A1TSHRTDP1MAPK1
SCHEMBL27920159 0.82 TSHR (0.44) SMN1; SMN2ALDH1A1TSHRTDP1MAPK1
SCHEMBL6053204 0.81 TSHR (0.53) SMN1; SMN2ALDH1A1TSHRTDP1MAPK1
SCHEMBL2570908 0.81 ALDH1A1 (0.49) SMN1; SMN2ALDH1A1TSHRTDP1MAPK1
SCHEMBL28292332 0.81 SMN1; SMN2 (0.51) SMN1; SMN2ALDH1A1TSHRTDP1MAPK1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 30 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-110520496-A Crosslinkable pressure-sensitive adhesive substance TESA SE 2019-11-29 CN claimed
CN-118290932-A Nylon composite material and preparation method and application thereof 上海金发科技发展有限公司 2024-07-05 CN disclosed
CN-118006043-A Polypropylene composite material and preparation method and application thereof 金发科技股份有限公司 2024-05-10 CN disclosed
CN-110051886-A The medical device and method that antithrombotic generates 柯惠有限合伙公司 2019-07-26 CN disclosed
CN-105744965-B Antithrombotic medical devices and methods 柯惠有限合伙公司 2019-07-09 CN disclosed
CN-109476961-A Reducing side edge tack in adhesive tape rolls 德莎欧洲股份公司 2019-03-15 CN disclosed
CN-108699421-A selectively adhesive silicone rubber 美国陶氏有机硅公司 2018-10-23 CN disclosed
EP-2233511-B1 NOVEL POLYMER PARTICLE AND USE THEREOF MITSUI CHEMICALS INC (JP) 2017-03-22 EP disclosed
US-9150422-B2 Porous metal oxide, method for producing the same, and use of the same MITSUI CHEMICALS, INC. (JP) 2015-10-06 US disclosed
US-20150152322-A1 POLYMER PARTICLES AND USE THEREOF MITSUI CHEMICALS, INC. (JP) 2015-06-04 US disclosed
US-20100048745-A1 POROUS POLYIMIDE IBIDEN CO., LTD (JP) 2010-02-25 US disclosed
EP-2128193-A1 POROUS POLYIMIDE Ibiden Co., Ltd. (JP) 2009-12-02 EP disclosed
US-20090171003-A1 Gas-barrier composition, coating film and method for production of the same, and layered material MITSUI CHEMICALS, INC. (JP) 2009-07-02 US disclosed
US-7524900-B2 Gas-barrier composition, coating film and method for production of the same, and layered material MITSUI CHEMICALS, INC. (JP) 2009-04-28 US disclosed
EP-1894971-A1 GAS BARRIER COMPOSITION, COATING FILM, METHODS FOR PRODUCING THOSE, AND MULTILAYER BODY Mitsui Chemicals, Inc. (JP) 2008-03-05 EP disclosed
US-20060293448-A1 Gas-barrier composition, coating film and method for production of the same, and layered material MITSUI CHEMICALS, INC. (JP) 2006-12-28 US disclosed
EP-1217040-B1 Polycarbonate resin composition and its molded articles MITSUBISHI ENG PLASTICS CORP (JP) 2005-03-02 EP disclosed
US-6664313-B2 Heat stability, light reflectance, flame retardancy MITSUBISHI ENGINEERING-PLASTICS CORPORATION (JP) 2003-12-16 US disclosed
US-20020146550-A1 Polycarbonate resin composition and its molded articles MITSUBISHI ENGINEERING-PLASTICS CORPORATION (JP) 2002-10-10 US disclosed
EP-1217040-A1 Polycarbonate resin composition and its molded articles MITSUBISHI ENGINEERING-PLASTICS CORPORATION (JP) 2002-06-26 EP disclosed