Predicted protein targets (top 6)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | HSD11B1 | P28845 | 5/20 | 0.32 |
| ▸ | SCN9A | Q15858 | 2/20 | 0.31 |
| ▸ | L3MBTL1 | Q9Y468 | 1/20 | 0.31 |
| ▸ | EPHX2 | P34913 | 1/20 | 0.31 |
| ▸ | EPHX1 | P07099 | 1/20 | 0.31 |
| ▸ | FKBP1A | P62942 | 1/20 | 0.30 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL824270 | 0.85 | SCN9A (0.32) | HSD11B1SCN9A | |
| SCHEMBL47501 | 0.84 | HSD11B1 (0.33) | HSD11B1L3MBTL1EPHX2EPHX1FKBP1A | |
| SCHEMBL12755572 | 0.84 | HSD11B1 (0.33) | HSD11B1L3MBTL1EPHX2EPHX1FKBP1A | |
| SCHEMBL16487733 | 0.82 | FKBP1A (0.36) | HSD11B1SCN9AL3MBTL1EPHX2EPHX1 | |
| SCHEMBL18898001 | 0.82 | HSD11B1 (0.32) | HSD11B1L3MBTL1EPHX2EPHX1FKBP1A | |
| SCHEMBL13475391 | 0.80 | EPHX2 (0.33) | HSD11B1SCN9AL3MBTL1EPHX2EPHX1 | |
| SCHEMBL13879053 | 0.78 | EPHX1 (0.37) | HSD11B1EPHX1 | |
| SCHEMBL26939736 | 0.78 | HSD11B1 (0.38) | HSD11B1SCN9AEPHX2EPHX1FKBP1A | |
| SCHEMBL13821661 | 0.77 | EPHX1 (0.36) | HSD11B1EPHX1 | |
| SCHEMBL13879052 | 0.77 | EPHX1 (0.36) | HSD11B1EPHX1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 44 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-8574813-B2 | Resist composition for immersion exposure and method of forming resist pattern | TOKYO OHKA KOGYO CO., LTD. (JP) | 2013-11-05 | — | — | US | disclosed |
| US-8399173-B2 | Resist composition and resist pattern forming method | TOKYO OHKA KOGYO CO., LTD. (JP) | 2013-03-19 | — | — | US | disclosed |
| US-20120225383-A1 | RESIST COMPOSITION FOR IMMERSION EXPOSURE AND METHOD OF FORMING RESIST PATTERN | TOKYO OHKA KOGYO CO., LTD. (JP) | 2012-09-06 | — | — | US | disclosed |
| US-8192914-B2 | Resist composition for immersion exposure and method of forming resist pattern | TOKYO OHKA KOGYO CO., LTD. (JP) | 2012-06-05 | — | — | US | disclosed |
| US-8007981-B2 | Resist composition and method of forming resist pattern | TOKYO OHKA KOGYO CO., LTD. (JP) | 2011-08-30 | — | — | US | disclosed |
| US-7972762-B2 | resist pattern with reduced defects and excellent lithographic characteristics; acrylate ester copolymer obtained by polymerizing an ( alpha -lower alkyl)acrylate ester having tertiary alkyl ester-type acid dissociable dissolution inhibiting group, under a presence of acid | TOKYO OHKA KOGYO CO., LTD. (JP) | 2011-07-05 | — | — | US | disclosed |
| US-7968269-B2 | Positive resist composition for immersion exposure and method of forming resist pattern | TOKYO OHKA KOGYO CO., LTD. (JP) | 2011-06-28 | — | — | US | disclosed |
| US-7964331-B2 | Positive resist composition and method of forming resist pattern | TOKYO OHKA KOGYO CO., LTD. (JP) | 2011-06-21 | — | — | US | disclosed |
| US-7939243-B2 | Resin, resist composition and method of forming resist pattern | TOKYO OHKA KOGYO CO., LTD. (JP) | 2011-05-10 | — | — | US | disclosed |
| US-7919227-B2 | Positive resist composition and method of forming resist pattern | TOKYO OHKA KOGYO CO., LTD. (JP) | 2011-04-05 | — | — | US | disclosed |
| US-20090155713-A1 | RESIST COMPOSITION AND PROCESS FOR PRODUCING SAME | TOKYO OHKA KOGYO CO., LTD. (JP) | 2009-06-18 | — | — | US | disclosed |
| US-20090142696-A1 | POSITIVE RESIST COMPOSITION, POSITIVE RESIST COMPOSITION FOR THERMAL FLOW, AND RESIST PATTERN FORMING METHOD | TOKYO OHIKA KOGYO CO., LTD. (JP) | 2009-06-04 | — | — | US | disclosed |
| US-20090098483-A1 | POSITIVE RESIST COMPOSITION AND METHOD FOR FORMING RESIST PATTERN | TOKYO OHA KOGYO CO., LTD. (JP) | 2009-04-16 | — | — | US | disclosed |
| US-20090092924-A1 | METHOD OF PRODUCING POSITIVE RESIST COMPOSITION, POSITIVE RESIST COMPOSITION, AND METHOD OF FORMING RESIST PATTERN | TOKYO OHKA KOGYO CO., LTD. (JP) | 2009-04-09 | — | — | US | disclosed |
| US-20090075204-A1 | POSITIVE RESIST COMPOSITION AND METHOD OF FORMING RESIST PATTERN | TOKYO OHKA KOGYO CO., LTD (JP) | 2009-03-19 | — | — | US | disclosed |
| US-20090068583-A1 | resin comprises (2-adamantyloxymethyl)methacrylate monomers which exhibit increased alkali solubility under action of acid, and acid generator such as diphenyliodonium trifluoromethanesulfonate; reduced line edge roughness, improved shape and depth of focus | TOKYO OHKA KOGYO CO., LTD. (JP) | 2009-03-12 | — | — | US | disclosed |
| US-20090068588-A1 | POSITIVE RESIST COMPOSITION AND METHOD OF FORMING RESIST PATTERN | TOKYO OHKA KOGYO CO., LTD. (JP) | 2009-03-12 | — | — | US | disclosed |
| US-20090053650-A1 | RESIST COMPOSITION FOR IMMERSION EXPOSURE AND METHOD OF FORMING RESIST PATTERN | TOKYO OHKA KOGYO CO., LTD. (JP) | 2009-02-26 | — | — | US | disclosed |
| US-20090042130-A1 | POSITIVE RESIST COMPOSITION FOR IMMERSION EXPOSURE AND METHOD OF FORMING RESIST PATTERN | TOKYO OHKA KOGYO CO. LTD (JP) | 2009-02-12 | — | — | US | disclosed |
| US-20090035698-A1 | POSITIVE RESIST COMPOSITION AND RESIST PATTERN FORMING METHOD | TOKYO OHKA KOGYO CO., LTD. (JP) | 2009-02-05 | — | — | US | disclosed |